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LDC1312QDNTRQ1

Texas Instruments

LDC1312QDNTRQ1 by Texas Instruments

LDC1312QDNTRQ1 by Texas Instruments is a small outline, heat sink package with 12 terminals. It operates b/w -40 to 125 °C and has a supply voltage range of 2.7V to 3.6V, making it ideal for automotive applications requiring precise analog circuit functions.

Median Price

$1.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 77,008 parts In-Stock

1+ parts

$2.495

100+ parts

$2.061

1k+ parts

$1.114

10k+ parts

-

77,008

$2.495

$2.061

$1.114

-

Rochester

USA . 6,226 parts In-Stock

1+ parts

-

100+ parts

$1.610

1k+ parts

$1.440

10k+ parts

$1.350

6,226

-

$1.610

$1.440

$1.350

Verical

USA . 1,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.800

10k+ parts

$1.688

1,985

-

-

$1.800

$1.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,610 parts In-Stock

1+ parts

$1.472

100+ parts

-

1k+ parts

-

10k+ parts

-

4,610

$1.472

-

-

-

Vyrian

USA . 4,823 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

4,823

$1.550

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 24,438 parts In-Stock

1+ parts

$1.320

100+ parts

$1.287

1k+ parts

$1.280

10k+ parts

-

24,438

$1.320

$1.287

$1.280

-

Corphita

USA . 3,779 parts In-Stock

1+ parts

$1.395

100+ parts

-

1k+ parts

-

10k+ parts

-

3,779

$1.395

-

-

-

Corohmni

South Africa . 201 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$1.550

-

-

-

Ampacity Inc.

Singapore . 24,101 parts In-Stock

1+ parts

$2.870

100+ parts

-

1k+ parts

-

10k+ parts

-

24,101

$2.870

-

-

-

Parana Technologies

USA . 33 parts In-Stock

1+ parts

$4.211

100+ parts

-

1k+ parts

$4.647

10k+ parts

-

33

$4.211

-

$4.647

-

DigiPath Technology Company

USA . 2,073 parts In-Stock

1+ parts

$4.637

100+ parts

-

1k+ parts

-

10k+ parts

-

2,073

$4.637

-

-

-

ChromeModa Solutions

Germany . 5,268 parts In-Stock

1+ parts

$4.732

100+ parts

$3.880

1k+ parts

-

10k+ parts

-

5,268

$4.732

$3.880

-

-

IDEA Electronic Components Group

UK . 2,260 parts In-Stock

1+ parts

$4.732

100+ parts

-

1k+ parts

$4.259

10k+ parts

-

2,260

$4.732

-

$4.259

-

Overview

Discover the innovative LDC1312QDNTRQ1 by Texas Instruments, a top-quality product in the category of Other Function Semiconductors. With a focus on reliability and performance, Texas Instruments has established itself as a trusted manufacturer in the industry. This versatile product is designed for a wide range of applications, offering customers exceptional value and benefits. From automotive to industrial uses, this product is sure to meet your needs with its high-quality design and advanced features. Choose Texas Instruments for cutting-edge technology and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving space and reducing production time.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage ensures compatibility with a wide variety of systems and components, making it versatile for different applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand demanding operating conditions, ensuring reliability and longevity.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring stable electrical connections and long-term performance.

Width (mm): 4 mm

The compact 4mm width allows for space-saving installation in tight layouts, making it suitable for applications where size is a constraint.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage of 2.7V allows for efficient power management in energy-conscious designs, making it suitable for battery-operated devices.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade indicates that this product meets stringent automotive industry standards for reliability and performance in harsh operating environments.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this product is suitable for a wide range of manufacturing and storage conditions, ensuring consistent quality and reliability.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V gives this product a wide operating range, making it suitable for diverse applications with varying power requirements.

Technical Specifications

Other Function Semiconductors LDC1312QDNTRQ1 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N12

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LDC1312QDNTRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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