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LDC1612QDNTRQ1

Texas Instruments

LDC1612QDNTRQ1 by Texas Instruments

LDC1612QDNTRQ1 by Texas Instruments is a small outline, heat sink package with 12 terminals. It operates b/w -40 to 125°C and has a supply voltage range of 2.7V to 3.6V, making it ideal for automotive applications requiring precise analog circuit functions.

Median Price

$4.370

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 44,066 parts In-Stock

1+ parts

$3.022

100+ parts

$2.496

1k+ parts

$1.349

10k+ parts

-

44,066

$3.022

$2.496

$1.349

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Mouser Electronics

USA . 3,806 parts In-Stock

1+ parts

$4.370

100+ parts

$2.760

1k+ parts

$2.460

10k+ parts

$2.350

3,806

$4.370

$2.760

$2.460

$2.350

DigiKey

USA . 2,553 parts In-Stock

1+ parts

$4.370

100+ parts

$2.757

1k+ parts

$2.612

10k+ parts

-

2,553

$4.370

$2.757

$2.612

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.062

100+ parts

-

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10

$2.062

-

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Digiode

USA . 3,118 parts In-Stock

1+ parts

$2.871

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-

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3,118

$2.871

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Vyrian

USA . 17,226 parts In-Stock

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17,226

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Cyclops Electronics Ltd

UK . 7,500 parts In-Stock

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7,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,077 parts In-Stock

1+ parts

$2.062

100+ parts

-

1k+ parts

-

10k+ parts

$2.020

2,077

$2.062

-

-

$2.020

Argo Parts USA

USA . 578 parts In-Stock

1+ parts

$2.062

100+ parts

-

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578

$2.062

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-

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Ampacity Inc.

Singapore . 17,349 parts In-Stock

1+ parts

$2.570

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-

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17,349

$2.570

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Semicontronic

India . 17,092 parts In-Stock

1+ parts

$2.570

100+ parts

$2.506

1k+ parts

$2.493

10k+ parts

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17,092

$2.570

$2.506

$2.493

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Corphita

USA . 3,825 parts In-Stock

1+ parts

$2.720

100+ parts

-

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3,825

$2.720

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Parana Technologies

USA . 478 parts In-Stock

1+ parts

$12.586

100+ parts

-

1k+ parts

$13.041

10k+ parts

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478

$12.586

-

$13.041

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DigiPath Technology Company

USA . 1,307 parts In-Stock

1+ parts

$13.859

100+ parts

$12.750

1k+ parts

-

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1,307

$13.859

$12.750

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IDEA Electronic Components Group

UK . 1,961 parts In-Stock

1+ parts

$14.142

100+ parts

$13.435

1k+ parts

$12.728

10k+ parts

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1,961

$14.142

$13.435

$12.728

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ChromeModa Solutions

Germany . 281 parts In-Stock

1+ parts

$14.142

100+ parts

$11.596

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281

$14.142

$11.596

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Aztec Data Supply Inc.

USA . 4,668 parts In-Stock

1+ parts

$16.280

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4,668

$16.280

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Lixinc

USA . 13,530 parts In-Stock

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13,530

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 4,590 parts In-Stock

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4,590

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Alle Elektronik GmbH

Germany . 3,060 parts In-Stock

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3,060

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.020

1k+ parts

$1.958

10k+ parts

$1.917

500

-

$2.020

$1.958

$1.917

Overview

Elevate your automotive electronics with the LDC1612QDNTRQ1 by Texas Instruments. Manufactured with precision and expertise, this small outline, heat sink semiconductor offers unparalleled performance and reliability. With a wide operating temperature range and dual terminal position, this analog circuit is perfect for a variety of applications in the automotive industry. Trust in Texas Instruments to provide top-quality products that deliver value and innovation to your projects. Unlock the potential of your designs with the LDC1612QDNTRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape offers a compact design, saving valuable space on the circuit board and facilitating easier routing of traces.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3 V is a common standard in many applications, making this product compatible with a wide range of systems and devices.

No. of Terminals: 12

With 12 terminals, this product offers ample connectivity options, allowing for versatile applications in various circuit configurations.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhances heat dissipation and power efficiency, making it suitable for high-performance applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in extreme operating conditions, making it suitable for industrial or automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments, expanding the product's range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections for the product's lifespan.

Terminal Position: DUAL

Dual terminal positions provide redundancy and increased reliability in connecting to the circuit board, reducing the risk of connection failures.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm allows for a slim profile, making it suitable for space-constrained applications.

Width (mm): 4 mm

The compact 4 mm width makes this product suitable for applications where board space is limited, allowing for efficient use of available space.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type, this product is designed for precise and accurate signal processing, making it suitable for applications requiring high fidelity.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7 V allows for power-efficient operation in low-power applications, maximizing battery life and energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product ensures reliable soldering during assembly, reducing the risk of damage to the components.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and mechanical bonding during the manufacturing process, maintaining the long-term reliability of the product.

Length: 4 mm

The 4 mm length of the product contributes to its compact form factor, making it suitable for applications where space is at a premium.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures that this product meets the stringent requirements for reliability and performance in automotive applications, making it a reliable choice for automotive electronics.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joints cracking, enhancing the longevity and reliability of the product in high-stress environments.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product offers high-density interconnect options, allowing for efficient use of board space in compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this product has a moderate moisture sensitivity level, ensuring proper handling and storage procedures to maintain its performance.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V provides a safety margin for voltage spikes and fluctuations, ensuring the longevity and reliability of the product in varying operating conditions.

Technical Specifications

Other Function Semiconductors LDC1612QDNTRQ1 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N12

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LDC1612QDNTRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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