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LDC1041NHRJ

Texas Instruments

LDC1041NHRJ by Texas Instruments

The Texas Instruments LDC1041NHRJ is a 16-terminal analog circuit IC with a nominal voltage of 5V. With a small outline package style and operating temperature range from -40 to 125°C, it is ideal for automotive applications requiring precise sensing and measurement capabilities. The device features surface mount capability, matte tin terminal finish, and compact dimensions of 4mm width by 5mm length.

Median Price

$4.112

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,125 parts In-Stock

1+ parts

$1.240

100+ parts

$1.190

1k+ parts

$1.130

10k+ parts

-

1,125

$1.240

$1.190

$1.130

-

Texas Instruments

USA . 26,949 parts In-Stock

1+ parts

$6.983

100+ parts

$5.693

1k+ parts

$3.795

10k+ parts

-

26,949

$6.983

$5.693

$3.795

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,885 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

-

10k+ parts

-

4,885

$1.178

-

-

-

Vyrian

USA . 9,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,174

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,659 parts In-Stock

1+ parts

$1.050

100+ parts

-

1k+ parts

-

10k+ parts

-

13,659

$1.050

-

-

-

Semicontronic

India . 13,615 parts In-Stock

1+ parts

$1.050

100+ parts

$1.024

1k+ parts

$1.018

10k+ parts

-

13,615

$1.050

$1.024

$1.018

-

Corphita

USA . 4,850 parts In-Stock

1+ parts

$1.116

100+ parts

-

1k+ parts

-

10k+ parts

-

4,850

$1.116

-

-

-

Corohmni

South Africa . 255 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

-

10k+ parts

-

255

$1.240

-

-

-

Parana Technologies

USA . 124 parts In-Stock

1+ parts

$8.365

100+ parts

-

1k+ parts

$8.994

10k+ parts

-

124

$8.365

-

$8.994

-

DigiPath Technology Company

USA . 1,417 parts In-Stock

1+ parts

$9.211

100+ parts

$8.474

1k+ parts

-

10k+ parts

-

1,417

$9.211

$8.474

-

-

ChromeModa Solutions

Germany . 6,779 parts In-Stock

1+ parts

$9.399

100+ parts

$7.707

1k+ parts

-

10k+ parts

-

6,779

$9.399

$7.707

-

-

IDEA Electronic Components Group

UK . 1,100 parts In-Stock

1+ parts

$9.399

100+ parts

$8.929

1k+ parts

$8.459

10k+ parts

-

1,100

$9.399

$8.929

$8.459

-

AZTECH Wire

Italy . 370 parts In-Stock

1+ parts

$22.210

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$22.210

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Overview

Discover the innovative LDC1041NHRJ by Texas Instruments, a cutting-edge semiconductor device that offers unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product is designed for a wide range of applications in various industries. With its advanced features and high performance, this semiconductor provides customers with exceptional value, benefits, and advantages. Experience the difference with the LDC1041NHRJ and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material offers good durability and protection for the semiconductor, while epoxy provides excellent heat resistance, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common standard in many electronic systems, ensuring compatibility with various devices and circuits.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and flexibility in designing circuits or systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and performance in demanding environments and conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold environments without compromising functionality.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and solderability, ensuring secure connections during assembly.

Width (mm): 4 mm

The compact 4mm width of the package allows for space-saving integration in small electronic devices or PCB layouts.

Minimum Supply Voltage (Vsup): 4.75 V

With a minimum supply voltage of 4.75V, the semiconductor can operate efficiently even with slight fluctuations in power supply.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering and assembly for robust connections.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the product meets stringent requirements for reliability, performance, and durability in automotive applications.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with regulations, making it a sustainable choice for electronic manufacturing.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25V provides a safe operating range without risking damage to the semiconductor from overvoltage conditions.

Technical Specifications

Other Function Semiconductors LDC1041NHRJ attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LDC1041NHRJ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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