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LDC1612DNTT

Texas Instruments

LDC1612DNTT by Texas Instruments

LDC1612DNTT by Texas Instruments is a 12-terminal analog circuit IC with a supply voltage range of 2.7V to 3.6V, suitable for automotive applications. It features a small outline package style with very thin profile and matte tin terminal finish, making it ideal for surface mount assembly in tight spaces. With dual terminal position and no-lead form, this sensor offers precise measurements at temperatures ranging from -40°C to 125°C.

Median Price

$2.160

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 18 parts In-Stock

1+ parts

$0.617

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-

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18

$0.617

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Chip1Stop

Japan . 106 parts In-Stock

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$1.990

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106

$1.990

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DigiKey

USA . 886 parts In-Stock

1+ parts

$4.240

100+ parts

$2.669

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886

$4.240

$2.669

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Mouser Electronics

USA . 225 parts In-Stock

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-

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$2.330

10k+ parts

$2.060

225

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$2.330

$2.060

Verical

USA . 18 parts In-Stock

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18

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Distributors (In-Stock)

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Digiode

USA . 227 parts In-Stock

1+ parts

$0.664

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227

$0.664

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$2.903

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600

$2.903

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Chip Stock

USA . 21,600 parts In-Stock

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21,600

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North Shore Components

USA . 8,500 parts In-Stock

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8,500

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Vyrian

USA . 311 parts In-Stock

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311

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ACDS - Activité Composants Distribution Service

France . 150 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 311 parts In-Stock

1+ parts

$0.590

100+ parts

-

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311

$0.590

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Semicontronic

India . 120 parts In-Stock

1+ parts

$0.590

100+ parts

$0.575

1k+ parts

$0.572

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120

$0.590

$0.575

$0.572

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Corphita

USA . 2,428 parts In-Stock

1+ parts

$0.629

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2,428

$0.629

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Continental Prestige Electronics

USA . 5,333 parts In-Stock

1+ parts

$2.903

100+ parts

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10k+ parts

$2.845

5,333

$2.903

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-

$2.845

Argo Parts USA

USA . 1,178 parts In-Stock

1+ parts

$2.903

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1,178

$2.903

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Parana Technologies

USA . 1,308 parts In-Stock

1+ parts

$20.961

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$21.174

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1,308

$20.961

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$21.174

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DigiPath Technology Company

USA . 1,471 parts In-Stock

1+ parts

$23.081

100+ parts

$21.234

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1,471

$23.081

$21.234

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Corohmni

South Africa . 322 parts In-Stock

1+ parts

$23.277

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322

$23.277

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ChromeModa Solutions

Germany . 5,682 parts In-Stock

1+ parts

$23.552

100+ parts

$19.313

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5,682

$23.552

$19.313

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IDEA Electronic Components Group

UK . 174 parts In-Stock

1+ parts

$23.552

100+ parts

$22.374

1k+ parts

$21.197

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174

$23.552

$22.374

$21.197

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Microchip USA

USA . 2,592 parts In-Stock

1+ parts

$23.930

100+ parts

$23.580

1k+ parts

$23.410

10k+ parts

$23.240

2,592

$23.930

$23.580

$23.410

$23.240

Lixinc

USA . 11,378 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,313 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,542 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,295 parts In-Stock

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4,295

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Futuretech Components

Singapore . 3,730 parts In-Stock

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3,730

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Metaverse IC Inc.

Canada . 327 parts In-Stock

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327

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GreenTree Electronics

Israel . 150 parts In-Stock

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150

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Overview

Unlock the power of precision with the LDC1612DNTT by industry leader Texas Instruments. This cutting-edge semiconductor offers unparalleled quality and reliability, making it ideal for a wide range of applications. From automotive to industrial settings, this versatile device delivers unmatched performance and accuracy. Experience the value of superior technology and elevate your projects with the LDC1612DNTT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and durable, making it a suitable choice for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto a PCB, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 3.3 V

This voltage level is commonly used in many electronic devices, ensuring compatibility with a wide range of systems.

No. of Terminals: 12

Having a sufficient number of terminals enables the device to accommodate multiple connections, enhancing versatility and functionality.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the device can withstand harsh environmental conditions and operate reliably in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the device to function effectively even in cold environments, increasing its usability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity, ensuring a secure and stable connection during assembly.

Width (mm): 4 mm

The compact width allows for space-saving and efficient PCB layout, making the product suitable for applications with limited space.

No. of Channels: 2

Having multiple channels allows for simultaneous processing of multiple signals or data streams, improving overall performance and efficiency.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources and helps protect the device from overvoltage situations.

Technical Specifications

Other Function Semiconductors LDC1612DNTT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N12

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LDC1612DNTT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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