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JM38510/00903BDA

Texas Instruments

JM38510/00903BDA by Texas Instruments

JM38510/00903BDA by Texas Instruments is an 8-bit digital shift register with a propagation delay of 37ns. It operates b/w -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 4.5V to 5.5V, it features positive edge triggering and a max frequency of 36MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,477 parts In-Stock

1+ parts

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9,477

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Digiode

USA . 3,695 parts In-Stock

1+ parts

-

100+ parts

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3,695

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$5.124

100+ parts

-

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884

$5.124

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Parana Technologies

USA . 2,361 parts In-Stock

1+ parts

$10.545

100+ parts

$979.237

1k+ parts

$9.490

10k+ parts

-

2,361

$10.545

$979.237

$9.490

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DigiPath Technology Company

USA . 1,840 parts In-Stock

1+ parts

$11.611

100+ parts

$10.682

1k+ parts

-

10k+ parts

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1,840

$11.611

$10.682

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ChromeModa Solutions

Germany . 2,912 parts In-Stock

1+ parts

$11.848

100+ parts

$9.715

1k+ parts

-

10k+ parts

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2,912

$11.848

$9.715

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IDEA Electronic Components Group

UK . 886 parts In-Stock

1+ parts

$11.848

100+ parts

$11.256

1k+ parts

$10.663

10k+ parts

-

886

$11.848

$11.256

$10.663

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One Stop Electronics

USA . 934 parts In-Stock

1+ parts

$53.000

100+ parts

-

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934

$53.000

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Corphita

USA . 4,795 parts In-Stock

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4,795

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Overview

Unlock the power of precision with the JM38510/00903BDA by Texas Instruments, a top-tier manufacturer renowned for quality and reliability. As a digital shift register, this product offers seamless integration and superior performance in a wide range of applications. From military-grade technology to a maximum operating temperature of 125°C, this versatile component ensures unmatched durability and efficiency. Elevate your projects with the value, benefits, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components of the shift register, ensuring reliable performance over time.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage, making it compatible with common power sources.

Propagation Delay (tpd): 37 ns

Fast propagation delay allows for quick data transmission within the shift register.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without compromising performance.

Temperature Grade: MILITARY

Designed to meet military grade standards, ensuring reliability and durability in rugged conditions.

Technical Specifications

Digital Shift Registers JM38510/00903BDA attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

54 mA

Propagation Delay (tpd):

37 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.29 mm

Minimum fmax:

36 MHz

Trade Compliance

JM38510/00903BDA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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