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JM38510/00902BEB

Texas Instruments

JM38510/00902BEB by Texas Instruments

JM38510/00902BEB by Texas Instruments is a 5-bit digital shift register with 16 terminals. It operates at a supply voltage of 4.5-5.5V and has a propagation delay of 40ns. Ideal for military applications due to its MILITARY temperature grade, TTL technology, and positive edge trigger type.

Median Price

$19.600

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 8 parts In-Stock

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$9.706

100+ parts

$10.191

1k+ parts

$9.609

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Forefront Electronics and Design

USA . 1 parts In-Stock

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$19.600

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American Microsemiconductor Inc.

USA . 11 parts In-Stock

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$45.510

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Vyrian

USA . 3,834 parts In-Stock

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Digiode

USA . 2,552 parts In-Stock

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Anansix

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Electronic Expediters

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Resion

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Elcom Components

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Prism Electronics

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MISTER SPROCKETS

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,699 parts In-Stock

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$10.216

100+ parts

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$10.751

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$10.216

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DigiPath Technology Company

USA . 1,091 parts In-Stock

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$11.249

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ChromeModa Solutions

Germany . 5,565 parts In-Stock

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$11.479

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$9.413

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IDEA Electronic Components Group

UK . 524 parts In-Stock

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$11.479

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$10.905

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$10.331

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524

$11.479

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AZTECH Wire

Italy . 336 parts In-Stock

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$19.579

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One Stop Electronics

USA . 1,552 parts In-Stock

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$58.000

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Corphita

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Assy Fe

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Perfect Parts

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Overview

Unleash the power of cutting-edge technology with the JM38510/00902BEB by Texas Instruments. Designed with precision and expertise, this digital shift register offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides seamless integration and exceptional functionality. Elevate your projects with the quality and innovation that only Texas Instruments can deliver. Experience the difference with the JM38510/00902BEB - where excellence meets efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability, ensuring the product can withstand harsh environments.

No. of Bits: 5

Offers a sufficient number of bits for various digital shifting applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies commonly used in many electronic devices.

Propagation Delay (tpd): 40 ns

Fast propagation delay ensures quick data shifting for efficient operation.

Temperature Grade: MILITARY

Designed to meet military standards for temperature range and reliability, suitable for rugged applications.

Technical Specifications

Digital Shift Registers JM38510/00902BEB attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

CLEAR FOLLOWED BY SELECTIVE PRESET IMITATES LOAD

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

68 mA

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

10 MHz

Trade Compliance

JM38510/00902BEB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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