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JM38510/00903BCX

Texas Instruments

JM38510/00903BCX by Texas Instruments

JM38510/00903BCX by Texas Instruments is an 8-bit digital shift register with a propagation delay of 32ns. Operating temperature ranges from -55 to 125°C, suitable for military-grade applications. Features include a supply voltage of 4.5-5.5V, TTL technology, and a max frequency of 25MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,419 parts In-Stock

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5,419

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Digiode

USA . 2,615 parts In-Stock

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2,615

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Distributors (Availability)

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AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$9.837

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397

$9.837

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Parana Technologies

USA . 1,674 parts In-Stock

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$15.800

100+ parts

-

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$16.156

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1,674

$15.800

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$16.156

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DigiPath Technology Company

USA . 1,377 parts In-Stock

1+ parts

$17.398

100+ parts

$16.006

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1,377

$17.398

$16.006

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IDEA Electronic Components Group

UK . 967 parts In-Stock

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$17.753

100+ parts

$16.865

1k+ parts

$15.978

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967

$17.753

$16.865

$15.978

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ChromeModa Solutions

Germany . 766 parts In-Stock

1+ parts

$17.753

100+ parts

$14.557

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766

$17.753

$14.557

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One Stop Electronics

USA . 1,156 parts In-Stock

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$43.000

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$43.000

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Corphita

USA . 1,380 parts In-Stock

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Overview

Upgrade your digital shift register game with the JM38510/00903BCX by Texas Instruments. Crafted with top-quality ceramic and glass-sealed materials, this military-grade device offers lightning-fast propagation delay of 32ns and a maximum operating temperature of 125°C. Perfect for applications requiring precision and reliability, this 8-bit shift register is designed to exceed expectations. Trust in Texas Instruments for unparalleled quality and performance in every project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection, ensuring the shift register remains intact in various environments.

Nominal Supply Voltage / Vsup (V): 5

Suitable for standard power supply voltages, making it compatible with common electronic systems.

Propagation Delay (tpd): 32 ns

Fast propagation delay ensures efficient and quick data shifting operations.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows precise control over when data is shifted, enhancing overall performance.

Technology: TTL

Utilization of TTL technology ensures reliable and accurate data transmission within the shift register.

Minimum fmax: 25 MHz

High maximum frequency allows for rapid data processing and manipulation.

Technical Specifications

Digital Shift Registers JM38510/00903BCX attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

GATED SERIAL INPUTS (A AND B)

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

JM38510/00903BCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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