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JM38510/00901BDA

Texas Instruments

JM38510/00901BDA by Texas Instruments

JM38510/00901BDA by Texas Instruments is a 4-bit digital shift register with a supply voltage of 5V and propagation delay of 32ns. Ideal for military applications, it operates b/w -55 to 125°C, features negative edge trigger, and supports a max clock frequency of 36MHz.

Median Price

$13.915

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 91 parts In-Stock

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$13.915

100+ parts

$14.611

1k+ parts

$13.776

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Vyrian

USA . 6,774 parts In-Stock

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Digiode

USA . 4,014 parts In-Stock

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Anansix

USA . 1,259 parts In-Stock

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Resion

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Mil-Aero Solutions, Inc.

USA . 27 parts In-Stock

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Electronic Expediters

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Sunrise Surplus Inc.

USA . 2 parts In-Stock

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Parana Technologies

USA . 2,317 parts In-Stock

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$10.993

100+ parts

$1,020.893

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$9.894

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DigiPath Technology Company

USA . 1,125 parts In-Stock

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$12.105

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$11.137

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IDEA Electronic Components Group

UK . 2,363 parts In-Stock

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$12.352

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$11.734

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$11.117

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ChromeModa Solutions

Germany . 1,197 parts In-Stock

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$12.352

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$10.129

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AZTECH Wire

Italy . 881 parts In-Stock

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$13.166

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One Stop Electronics

USA . 1,371 parts In-Stock

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$56.000

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Corphita

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Overview

Elevate your digital shift register game with the JM38510/00901BDA by Texas Instruments. Crafted with precision and quality materials, this rectangular flatpack package offers a seamless surface mount solution for applications requiring reliable data storage and transmission. With a nominal supply voltage of 5V and quick 32ns propagation delay, this military-grade device ensures optimal performance even in extreme temperatures. Experience the benefits of true output polarity, negative edge trigger type, and dual terminal position, all packed into a compact design that boasts a maximum seated height of just 2.03mm. Trust Texas Instruments to deliver unparalleled value and efficiency in every product, making the JM38510/00901BDA a must-have for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

High durability and resistance to temperature and moisture, ensuring reliability in various operating conditions.

No. of Bits: 4

Suitable for applications that require processing of 4-bit data sequences, offering flexibility and compactness.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply for compatibility with most electronics, ensuring easy integration in various systems.

Propagation Delay (tpd): 32 ns

High-speed operation for efficient data processing and transfer within the shift register.

Temperature Grade: MILITARY

Designed to meet rigorous military standards for performance and reliability in harsh environments.

Technology: TTL

Utilizes transistor-transistor logic for reliable digital signal processing and compatibility with TTL-based systems.

Technical Specifications

Digital Shift Registers JM38510/00901BDA attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

SEPARATE CLOCKS FOR SHIFT RIGHT & LOAD

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

63 mA

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

6.29 mm

Minimum fmax:

36 MHz

Trade Compliance

JM38510/00901BDA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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