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JM38510/00902BFA

Texas Instruments

JM38510/00902BFA by Texas Instruments

JM38510/00902BFA by Texas Instruments is a 5-bit digital shift register with 40ns propagation delay. It operates b/w -55 to 125 °C and has a max supply voltage of 5.5V, making it ideal for military-grade applications requiring fast data shifting in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,061 parts In-Stock

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9,061

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Digiode

USA . 886 parts In-Stock

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886

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Electronic Expediters

USA . 232 parts In-Stock

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232

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Distributors (Availability)

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AZTECH Wire

Italy . 316 parts In-Stock

1+ parts

$8.965

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316

$8.965

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Parana Technologies

USA . 1,667 parts In-Stock

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$9.666

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$10.255

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$9.666

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DigiPath Technology Company

USA . 2,371 parts In-Stock

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$10.644

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2,371

$10.644

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ChromeModa Solutions

Germany . 5,651 parts In-Stock

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$10.861

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$8.906

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5,651

$10.861

$8.906

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IDEA Electronic Components Group

UK . 1,600 parts In-Stock

1+ parts

$10.861

100+ parts

$10.318

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$9.775

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1,600

$10.861

$10.318

$9.775

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One Stop Electronics

USA . 1,051 parts In-Stock

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$11.000

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$11.000

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Corphita

USA . 4,904 parts In-Stock

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4,904

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Overview

Experience top-notch quality and reliability with the JM38510/00902BFA by Texas Instruments, a leading manufacturer in the industry. As a digital shift register, this product offers unparalleled precision and efficiency in various applications. From military-grade durability to high-speed performance, this versatile component is designed to exceed your expectations. Trust in Texas Instruments to deliver cutting-edge technology that enhances your projects and unlocks endless possibilities. Elevate your work with the JM38510/00902BFA and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 5

Provides enough storage capacity for various data processing applications.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently with a standard 5V power supply, making it compatible with most systems.

Propagation Delay (tpd): 40 ns

Offers fast data processing speed, which is essential for time-sensitive applications.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, making it suitable for a wide range of applications.

Technology: TTL

Uses TTL technology, which is known for its reliability and compatibility with many digital systems.

Technical Specifications

Digital Shift Registers JM38510/00902BFA attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

CLEAR FOLLOWED BY SELECTIVE PRESET IMITATES LOAD

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

68 mA

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.73 mm

Minimum fmax:

10 MHz

Trade Compliance

JM38510/00902BFA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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