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SNC5491AW

Texas Instruments

SNC5491AW by Texas Instruments

SNC5491AW by Texas Instruments is an 8-bit digital shift register with a supply voltage of 5V. It features MIL-STD-883 Class B screening and operates in temperatures ranging from -55°C to 125°C. Ideal for military applications, this TTL technology device comes in a ceramic flatpack package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,832 parts In-Stock

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4,832

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Vyrian

USA . 4,100 parts In-Stock

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4,100

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Manoshevitz Elec. Sales

Israel . 23 parts In-Stock

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23

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$8.115

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478

$8.115

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Parana Technologies

USA . 1,226 parts In-Stock

1+ parts

$28.461

100+ parts

$2,643.064

1k+ parts

$25.615

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1,226

$28.461

$2,643.064

$25.615

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DigiPath Technology Company

USA . 1,404 parts In-Stock

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$31.339

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$31.339

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IDEA Electronic Components Group

UK . 2,283 parts In-Stock

1+ parts

$31.979

100+ parts

$30.380

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$28.781

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2,283

$31.979

$30.380

$28.781

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ChromeModa Solutions

Germany . 1,698 parts In-Stock

1+ parts

$31.979

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$26.223

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$26.223

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One Stop Electronics

USA . 864 parts In-Stock

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$55.000

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864

$55.000

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Corphita

USA . 4,052 parts In-Stock

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4,052

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Overview

Elevate your digital designs with the SNC5491AW by Texas Instruments, a premium quality digital shift register that offers unparalleled performance and reliability. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality in every product they produce. The SNC5491AW is ideal for a wide range of applications, providing seamless integration and exceptional functionality. Experience the value and benefits of this product firsthand, and unlock endless possibilities for your projects. Choose Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties, making this product suitable for high temperature environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Screening Level: MIL-STD-883 Class B (Modified)

This level of screening ensures reliability and quality, making this product ideal for military or aerospace applications.

No. of Bits: 8

8-bit configuration provides sufficient data storage capacity for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with many systems.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures without performance degradation, suitable for demanding environments.

Technology: TTL

Utilizing TTL technology ensures fast and reliable data processing.

Technical Specifications

Digital Shift Registers SNC5491AW attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

JESD-30 Code:

R-XDFP-F14

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Shift Registers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC5491AW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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