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SNC54165J

Texas Instruments

SNC54165J by Texas Instruments

SNC54165J by Texas Instruments is an 8-bit digital shift register with a supply voltage of 5V. Featuring a propagation delay of 31ns, it operates in temperatures ranging from -55 to 125°C. Ideal for military applications, this TTL technology device has a max frequency of 20MHz and comes in an inline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,510 parts In-Stock

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Digiode

USA . 812 parts In-Stock

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812

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Electronic Expediters

USA . 101 parts In-Stock

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101

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Inland Empire Components Inc.

USA . 23 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 14 parts In-Stock

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One Stop Electronics

USA . 735 parts In-Stock

1+ parts

$10.000

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735

$10.000

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AZTECH Wire

Italy . 308 parts In-Stock

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$17.330

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308

$17.330

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Parana Technologies

USA . 1,244 parts In-Stock

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$19.443

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$1,805.572

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$17.499

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1,244

$19.443

$1,805.572

$17.499

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DigiPath Technology Company

USA . 1,692 parts In-Stock

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$21.409

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$19.696

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$21.409

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ChromeModa Solutions

Germany . 3,695 parts In-Stock

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$21.846

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$17.914

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$21.846

$17.914

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IDEA Electronic Components Group

UK . 682 parts In-Stock

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$21.846

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$20.754

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$19.661

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682

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Corphita

USA . 2,496 parts In-Stock

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Overview

Enhance your digital shift register projects with the SNC54165J by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers a product that exceeds expectations. Perfect for military-grade applications, this digital shift register offers fast propagation delay and complementary output polarity to ensure seamless operation. With a wide temperature range and superior technology, the SNC54165J provides unmatched value and performance for all your electronic needs. Upgrade your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection, ensuring the longevity of the product in various operating conditions.

No. of Bits: 8

Offers enough bit capacity for a wide range of digital data shift operations.

Propagaion Delay (tpd): 31 ns

Fast propagation delay enables quick data shifts, making this product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, expanding the range of applications it can be used for.

Technology: TTL

TTL technology is known for its reliability and compatibility with various digital systems, ensuring seamless integration.

Technical Specifications

Digital Shift Registers SNC54165J attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

CLOCK INHIBIT

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

31 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Maximum Seated Height:

5.08 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

20 MHz

Trade Compliance

SNC54165J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-004-3918, 5962010043918

NIIN

010043918

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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