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SNC54199J

Texas Instruments

SNC54199J by Texas Instruments

SNC54199J by Texas Instruments is an 8-bit digital shift register with TTL technology. It operates at a supply voltage of 5V and has a temperature range from -55°C to 125°C, suitable for military applications. The package is ceramic, MIL-STD-883 Class B screened, with 24 terminals in an in-line rectangular shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,416 parts In-Stock

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6,416

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Digiode

USA . 3,302 parts In-Stock

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3,302

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Distributors (Availability)

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AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$19.123

100+ parts

-

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883

$19.123

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One Stop Electronics

USA . 366 parts In-Stock

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$21.000

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366

$21.000

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Parana Technologies

USA . 1,827 parts In-Stock

1+ parts

$22.050

100+ parts

$2,047.654

1k+ parts

$19.845

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1,827

$22.050

$2,047.654

$19.845

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DigiPath Technology Company

USA . 368 parts In-Stock

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$24.280

100+ parts

$22.337

1k+ parts

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368

$24.280

$22.337

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ChromeModa Solutions

Germany . 5,526 parts In-Stock

1+ parts

$24.775

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$20.316

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5,526

$24.775

$20.316

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IDEA Electronic Components Group

UK . 2,058 parts In-Stock

1+ parts

$24.775

100+ parts

$23.536

1k+ parts

$22.298

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2,058

$24.775

$23.536

$22.298

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Corphita

USA . 2,928 parts In-Stock

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Overview

Experience seamless digital data transfer with the SNC54199J by Texas Instruments, a top-quality digital shift register that offers superior performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed for military-grade applications, ensuring durability and precision in extreme conditions. With 8 bits and a nominal supply voltage of 5V, this rectangular-shaped register boasts 24 terminals and operates at temperatures ranging from -55 to 125°C. Trust in the proven technology of TTL and the expertise of Texas Instruments to deliver unmatched value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body provides excellent thermal conductivity and high mechanical strength, ensuring durability and reliability in extreme conditions.

Screening Level: MIL-STD-883 Class B (Modified)

Compliance with MIL-STD-883 Class B ensures high quality and reliability, meeting stringent military standards for rugged and dependable performance.

No. of Bits: 8

With 8 bits, this shift register can handle a wide range of data processing tasks, offering versatility and flexibility in digital applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this shift register is efficient and compatible with standard power sources, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this shift register is suitable for use in high-temperature environments, ensuring reliable performance under demanding conditions.

Technology: TTL

Using TTL technology, this shift register offers fast and reliable data processing, making it ideal for applications where speed and accuracy are crucial.

Technical Specifications

Digital Shift Registers SNC54199J attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

JESD-30 Code:

R-XDIP-T24

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Shift Registers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC54199J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-013-7663, 5962010137663, 5962-00-522-7919, 5962005227919

NIIN

010137663, 005227919

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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