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SNC54165W

Texas Instruments

SNC54165W by Texas Instruments

SNC54165W by Texas Instruments is an 8-bit digital shift register with a supply voltage of 5V. It features MIL-STD-883 Class B screening and operates in temperatures ranging from -55°C to 125°C. Ideal for military applications, this TTL technology device comes in a ceramic flatpack package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,248 parts In-Stock

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5,248

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Digiode

USA . 4,434 parts In-Stock

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4,434

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Distributors (Availability)

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$9.026

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766

$9.026

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One Stop Electronics

USA . 1,508 parts In-Stock

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$25.000

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1,508

$25.000

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Parana Technologies

USA . 238 parts In-Stock

1+ parts

$30.227

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$68.589

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238

$30.227

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$68.589

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ChromeModa Solutions

Germany . 3,237 parts In-Stock

1+ parts

$33.963

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$27.850

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3,237

$33.963

$27.850

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IDEA Electronic Components Group

UK . 1,943 parts In-Stock

1+ parts

$33.963

100+ parts

$32.265

1k+ parts

$30.567

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1,943

$33.963

$32.265

$30.567

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Corphita

USA . 2,675 parts In-Stock

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2,675

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DigiPath Technology Company

USA . 2,205 parts In-Stock

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$30.621

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2,205

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$30.621

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Overview

Looking for top-notch quality and reliability in your digital shift registers? Look no further than the SNC54165W by Texas Instruments. As a trusted leader in semiconductor manufacturing, Texas Instruments delivers high-performance components that exceed expectations. The SNC54165W offers unparalleled value with its MILITARY-grade temperature rating, flatpack package style, and 8-bit capacity. Ideal for a wide range of applications, this shift register is a versatile solution for your electronic design needs. Trust Texas Instruments to deliver excellence with every product, including the SNC54165W.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package provides excellent thermal performance and durability, making it suitable for military applications where reliability is crucial.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and making the product more cost-effective.

Screening Level: MIL-STD-883 Class B (Modified)

This modified MIL-STD-883 screening level ensures that the product meets high reliability standards often required in military and aerospace applications.

No. of Bits: 8

With 8 bits, this shift register can handle a range of data processing tasks efficiently and effectively.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5V makes this shift register compatible with standard TTL logic levels, allowing for easy integration into existing systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this shift register can withstand harsh environmental conditions typically found in military applications.

Minimum Operating Temperature: -55 °C

The shift register can operate reliably in extreme cold temperatures down to -55°C, expanding its potential use in various environments.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems and provides reliable performance.

Technical Specifications

Digital Shift Registers SNC54165W attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

JESD-30 Code:

R-XDFP-F16

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Shift Registers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNC54165W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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