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SNC5491AJ

Texas Instruments

SNC5491AJ by Texas Instruments

SNC5491AJ by Texas Instruments is an 8-bit digital shift register with TTL technology. Operating temperature range from -55°C to 125°C, suitable for military applications. Features MIL-STD-883 Class B screening level and a nominal voltage of 5V, in a ceramic rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,608 parts In-Stock

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Digiode

USA . 4,775 parts In-Stock

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Electronic Expediters

USA . 12 parts In-Stock

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First Choice Components Inc.

USA . 11 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 645 parts In-Stock

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$15.266

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645

$15.266

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Parana Technologies

USA . 1,380 parts In-Stock

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$25.474

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$2,365.691

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$22.927

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1,380

$25.474

$2,365.691

$22.927

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DigiPath Technology Company

USA . 1,491 parts In-Stock

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$28.051

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$25.806

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$28.051

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IDEA Electronic Components Group

UK . 1,466 parts In-Stock

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$28.623

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$27.192

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$25.761

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1,466

$28.623

$27.192

$25.761

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ChromeModa Solutions

Germany . 163 parts In-Stock

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$28.623

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$23.471

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One Stop Electronics

USA . 1,362 parts In-Stock

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$65.000

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Corphita

USA . 1,638 parts In-Stock

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Perfect Parts

USA . 25 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the SNC5491AJ by Texas Instruments, a leading manufacturer in the industry. This digital shift register offers unmatched performance in a variety of applications, making it the perfect choice for your project needs. With its MIL-STD-883 Class B screening level and military-grade temperature grade, this product ensures durability and precision in even the harshest conditions. Trust in Texas Instruments to deliver top-notch technology that exceeds expectations. Choose the SNC5491AJ for superior value, benefits, and advantages that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and durability, ensuring reliable performance in various operating conditions.

Screening Level: MIL-STD-883 Class B (Modified)

Compliance with MIL-STD-883 Class B standards ensures high quality and reliability in military applications.

No. of Bits: 8

This shift register has a sufficient number of bits for storing and shifting data in digital applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a supply voltage of 5V allows for compatibility with standard digital systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this shift register can withstand high temperature environments without performance degradation.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this shift register suitable for high-speed digital applications.

Technical Specifications

Digital Shift Registers SNC5491AJ attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

JESD-30 Code:

R-XDIP-T14

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Shift Registers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNC5491AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-572-6414, 5962005726414

NIIN

005726414

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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