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74LV4094DB

NXP Semiconductors

74LV4094DB by NXP Semiconductors

NXP Semiconductors' 74LV4094DB is an 8-bit digital shift register with a supply voltage of 3.3V, featuring a propagation delay of 90ns and operating temperature range from -40 to 125°C. Ideal for automotive applications, it offers true output polarity, positive edge trigger type, and a max frequency of 20MHz.

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7

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1k+

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Digiode

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Vyrian

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ComSIT Distribution GmbH

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Nova Conductors

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AZTECH Wire

Italy . 7,708 parts In-Stock

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Ampacity Inc.

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One Stop Electronics

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Overview

Upgrade your digital shift register capabilities with the 74LV4094DB by NXP Semiconductors, a high-quality solution offering unmatched performance and reliability. Ideal for various applications, this product stands out for its innovative design and advanced technology, providing customers with enhanced efficiency and functionality. Experience the value and benefits of seamless integration, precise output characteristics, and optimal performance in a compact and durable package. Trust NXP Semiconductors for top-notch semiconductor solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the shift register.

No. of Bits: 8

This shift register has 8 bits, allowing for a larger range of data storage and manipulation.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a moderate voltage level, making it compatible with a wide range of electronic systems.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in connecting to other devices or components in a circuit.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this shift register energy-efficient and reliable.

Technical Specifications

Digital Shift Registers 74LV4094DB attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Additional Features:

SISO OPERATION ALSO AVAILABLE

Count Direction:

RIGHT

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

90 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

20 MHz

Trade Compliance

74LV4094DB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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