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JM38510/00903BCB

Texas Instruments

JM38510/00903BCB by Texas Instruments

JM38510/00903BCB by Texas Instruments is an 8-bit digital shift register with a 5V supply voltage, 37ns propagation delay, and 36MHz min fmax. Ideal for military applications due to its MIL-graded temperature range of -55 to 125 °C and TRUE output polarity.

Median Price

$24.507

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 3 parts In-Stock

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$17.394

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$17.394

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American Microsemiconductor Inc.

USA . 9 parts In-Stock

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$31.620

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Vyrian

USA . 7,336 parts In-Stock

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Digiode

USA . 4,014 parts In-Stock

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Electronics Depot

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Electronic Expediters

USA . 59 parts In-Stock

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Zilex Electronics Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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MRC Electronics

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Elcom Components

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Corel Iberica Componentes, S.L.

Spain . 4 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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Mil-Aero Solutions, Inc.

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AZTECH Wire

Italy . 582 parts In-Stock

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$8.859

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Parana Technologies

USA . 1,272 parts In-Stock

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$24.233

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$24.893

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DigiPath Technology Company

USA . 1,067 parts In-Stock

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$26.683

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$24.549

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ChromeModa Solutions

Germany . 6,600 parts In-Stock

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$27.228

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$22.327

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IDEA Electronic Components Group

UK . 1,073 parts In-Stock

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$27.228

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$25.867

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$24.505

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One Stop Electronics

USA . 715 parts In-Stock

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$41.000

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Corphita

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4 Star Electronics, Inc. (Excess)

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Overview

Enhance your digital designs with the JM38510/00903BCB from Texas Instruments, a top-tier manufacturer known for high-quality components. As a digital shift register, this product offers seamless data shifting capabilities in various applications. With a MILITARY temperature grade and fast propagation delay of 37ns, this rectangular package ensures reliable performance even in challenging environments. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the value and benefits this product brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides reliable protection for the internal components, ensuring long-term durability and stability for the shift register.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage allows for compatibility with a wide range of systems and power sources.

Propagation Delay (tpd): 37 ns

The low propagation delay ensures quick and efficient data transfer within the shift register, contributing to overall system performance.

Temperature Grade: MILITARY

The military-grade temperature rating means this shift register can withstand extreme environmental conditions, making it suitable for rugged applications where reliability is paramount.

Technology: TTL

Using TTL technology ensures high speed and reliable data transmission, making this shift register ideal for applications requiring precise timing and synchronization.

Technical Specifications

Digital Shift Registers JM38510/00903BCB attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

54 mA

Propagation Delay (tpd):

37 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

36 MHz

Trade Compliance

JM38510/00903BCB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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