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JM38510/00906BEB

Texas Instruments

JM38510/00906BEB by Texas Instruments

JM38510/00906BEB by Texas Instruments is a 4-bit digital shift register with 16 terminals. It operates at a supply voltage range of 4.5V to 5.5V and has a propagation delay of 26ns. Ideal for military applications due to its MIL-graded temperature range and TTL technology, it features positive edge triggering and a max frequency of 39MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,353 parts In-Stock

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Resion

USA . 2,397 parts In-Stock

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Digiode

USA . 1,230 parts In-Stock

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Electronic Expediters

USA . 318 parts In-Stock

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MISTER SPROCKETS

USA . 10 parts In-Stock

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Parana Technologies

USA . 2,149 parts In-Stock

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$10.220

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$10.755

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DigiPath Technology Company

USA . 1,489 parts In-Stock

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$11.253

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$10.353

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ChromeModa Solutions

Germany . 1,750 parts In-Stock

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$11.483

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$9.416

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$11.483

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IDEA Electronic Components Group

UK . 238 parts In-Stock

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$11.483

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$10.909

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$10.335

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AZTECH Wire

Italy . 819 parts In-Stock

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$16.682

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One Stop Electronics

USA . 1,337 parts In-Stock

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$30.000

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Corphita

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Overview

Unlock the power of advanced digital shift register technology with the JM38510/00906BEB by Texas Instruments. Crafted with precision and expertise, this ceramic, glass-sealed rectangular package offers unparalleled performance in a compact design. Ideal for military-grade applications, this 4-bit shift register provides a seamless experience with a blazing fast propagation delay of 26ns and reliable TRUE output polarity. Elevate your projects with the quality and innovation that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durable and reliable packaging for the shift register, ensuring long-term performance and protection from external elements.

No. of Bits: 4

Perfect for applications that require a small number of bits for data storage and manipulation.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Propagation Delay (tpd): 26 ns

Offers fast data transfer speeds, enhancing the overall efficiency of the shift register.

Temperature Grade: MILITARY

Ensures reliable operation in a wide range of temperature conditions, making it suitable for military and industrial applications.

Minimum fmax: 39 MHz

Provides high frequency capability, allowing for rapid data processing and communication.

Technical Specifications

Digital Shift Registers JM38510/00906BEB attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

COMPLEMENTARY SERIAL SHIFT RIGHT OUTPUT

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

63 mA

Propagation Delay (tpd):

26 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

39 MHz

Trade Compliance

JM38510/00906BEB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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