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HEF4014BT

NXP Semiconductors

HEF4014BT by NXP Semiconductors

HEF4014BT by NXP Semiconductors is an 8-bit digital shift register with a supply voltage of 5V, operating temperature range from -40 to 85°C, and a propagation delay of 260ns. It is used in industrial applications requiring a max frequency of 6MHz, positive edge trigger type, and true output polarity.

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LWI Electronics Inc

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Ashlea Components Ltd

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Nova Conductors

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Singapore . 216 parts In-Stock

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Overview

Enhance your digital projects with the HEF4014BT by NXP Semiconductors, a top-quality manufacturer known for cutting-edge technology. This versatile digital shift register offers endless possibilities in various applications, providing customers with exceptional value and reliable performance. With its advanced features and benefits, this product ensures seamless operation and efficiency, making it the perfect choice for all your electronic needs. Elevate your projects to the next level with the HEF4014BT!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

No. of Bits: 8

Provides a moderate level of data storage capacity, suitable for many digital applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement makes it compatible with many systems and easy to integrate.

Propagation Delay (tpd): 260 ns

Fast propagation delay ensures efficient data processing and quick response times.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Maximum Frequency At Nominal Supply: 6000000 Hz

High-frequency capability allows for fast data transfer rates, making the product suitable for high-performance applications.

Technical Specifications

Digital Shift Registers HEF4014BT attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Additional Features:

OUTPUTS ALSO AVAILABLE AT 6TH AND 7TH STAGE OF THE SHIFT REGISTER

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

6000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

260 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

6 MHz

Trade Compliance

HEF4014BT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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