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74HC164N

NXP Semiconductors

74HC164N by NXP Semiconductors

74HC164N by NXP Semiconductors is an 8-bit digital shift register with a propagation delay of 255 ns and a max frequency of 24 MHz. It operates at a nominal voltage of 5V and has a load capacitance of 50 pF. This CMOS technology component is commonly used in automotive applications for data shifting tasks due to its positive edge trigger type.

Median Price

$0.640

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Argo Parts USA

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Overview

Unlock the power of digital shift registers with the NXP Semiconductors 74HC164N. Manufactured with top-quality materials and cutting-edge technology, this product offers fast propagation delay, true output polarity, and a wide operating temperature range for automotive applications. With 8 bits and a compact design, this shift register is versatile and reliable. Experience seamless data transfer and precise control in your projects with the 74HC164N from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy body material makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy PCB mounting and space-saving design, making it convenient for compact electronic devices.

No. of Bits: 8

With 8 bits, this product offers sufficient data storage capacity for various digital applications without being overly complex or difficult to manage.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing electronic systems.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for smooth signal transmission and reception, ensuring reliable data processing performance.

Power Supplies (V): 2/6

The dual power supply options of 2V and 6V provide flexibility in voltage selection, catering to different power requirements in various applications.

No. of Terminals: 14

With 14 terminals, this product offers multiple connectivity options for integrating with other electronic components, enhancing versatility in circuit design.

Package Style (Meter): IN-LINE

The in-line package style provides a compact form factor that is suitable for applications where space is limited, allowing for efficient use of PCB real estate.

Propagation Delay (tpd): 255 ns

The 255 ns propagation delay ensures fast data transfer speeds, making it suitable for high-speed applications where quick response times are critical.

Technical Specifications

Digital Shift Registers 74HC164N attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

24000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay (tpd):

255 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

24 MHz

Trade Compliance

74HC164N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-235-3496, 5962012353496

NIIN

012353496

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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