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ISO7230CDWG4

Texas Instruments

ISO7230CDWG4 by Texas Instruments

ISO7230CDWG4 by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -40 to 125 °C. It has a supply voltage range of 3.15V to 5.5V and is suitable for automotive applications due to its CMOS technology and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,497 parts In-Stock

1+ parts

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5,497

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Digiode

USA . 1,365 parts In-Stock

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1,365

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Cyclops Electronics Ltd

UK . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 817 parts In-Stock

1+ parts

$11.273

100+ parts

-

1k+ parts

$11.705

10k+ parts

-

817

$11.273

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$11.705

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ChromeModa Solutions

Germany . 3,402 parts In-Stock

1+ parts

$12.666

100+ parts

$10.386

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3,402

$12.666

$10.386

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IDEA Electronic Components Group

UK . 2,044 parts In-Stock

1+ parts

$12.666

100+ parts

$12.033

1k+ parts

$11.399

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-

2,044

$12.666

$12.033

$11.399

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AZTECH Wire

Italy . 665 parts In-Stock

1+ parts

$13.408

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665

$13.408

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One Stop Electronics

USA . 138 parts In-Stock

1+ parts

$15.500

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138

$15.500

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DigiPath Technology Company

USA . 1,055 parts In-Stock

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$11.420

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1,055

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$11.420

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Perfect Parts

USA . 153 parts In-Stock

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153

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Corphita

USA . 75 parts In-Stock

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75

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GreenTree Electronics

Israel . 63 parts In-Stock

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63

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Overview

Elevate your electronics with the Texas Instruments ISO7230CDWG4, a top-tier interface circuit designed to deliver exceptional quality and reliability. Manufactured by industry leader Texas Instruments, this innovative product boasts a wide range of applications in various industries. With its small outline package style and dual terminal position, this IC offers unmatched value and benefits to customers seeking high-performance solutions. Say goodbye to compromise and experience the advantages of the ISO7230CDWG4 for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the product onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this product can handle a wide range of input voltages, increasing its versatility in different systems.

No. of Functions: 3

Having 3 functions in a single IC reduces the need for multiple components, simplifying circuit design and saving valuable board space.

Package Shape: RECTANGULAR

The rectangular package shape provides easy integration into standard PCB layouts, enhancing compatibility with existing designs.

No. of Terminals: 16

With 16 terminals, this IC offers a sufficient number of inputs and outputs for connecting to other components, enabling complex functionality in the system.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures reliable performance even in harsh environmental conditions, making it suitable for use in various applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard in electronics, ensuring compatibility with a wide range of systems and devices.

Technical Specifications

Other Function Interface ICs ISO7230CDWG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 5 V FOR NORMAL OPERATION

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7230CDWG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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