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HPA02150RGER

Texas Instruments

HPA02150RGER by Texas Instruments

Texas Instruments' HPA02150RGER is a Power Management IC with 24 terminals in a square chip carrier package. Operating from -40 to 85°C, it has a supply voltage range of 3.9-17V and switcher configuration as BUCK. Ideal for industrial applications requiring power supply management circuits with compact dimensions and high thermal performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,993 parts In-Stock

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8,993

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Digiode

USA . 1,639 parts In-Stock

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1,639

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Distributors (Availability)

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One Stop Electronics

USA . 1,237 parts In-Stock

1+ parts

$0.500

100+ parts

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1,237

$0.500

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Parana Technologies

USA . 2,235 parts In-Stock

1+ parts

$2.468

100+ parts

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1k+ parts

$2.960

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2,235

$2.468

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$2.960

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DigiPath Technology Company

USA . 1,848 parts In-Stock

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$2.718

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1,848

$2.718

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ChromeModa Solutions

Germany . 5,354 parts In-Stock

1+ parts

$2.773

100+ parts

$2.274

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5,354

$2.773

$2.274

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IDEA Electronic Components Group

UK . 2,035 parts In-Stock

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$2.773

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$2.496

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2,035

$2.773

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$2.496

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Semicontronic

India . 1,451 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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1,451

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 494 parts In-Stock

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$11.011

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494

$11.011

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Microchip USA

USA . 4,892 parts In-Stock

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Corphita

USA . 3,833 parts In-Stock

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Corohmni

South Africa . 349 parts In-Stock

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Overview

Enhance your power management solutions with the HPA02150RGER by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch Power Management ICs that cater to a wide range of applications. This product offers customers unparalleled value and benefits, providing efficient power supply management circuitry in a compact and durable package. Say goodbye to power-related issues and elevate your projects with the HPA02150RGER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

Helps in maximizing space utilization on the PCB, making it suitable for compact electronic devices.

No. of Terminals: 24

Offers flexibility in connecting multiple components to the IC for enhanced functionality.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high temperature conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate efficiently in extremely cold environments, increasing the versatility of the product.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance, ensuring stable connections over time.

Maximum Seated Height: 1 mm

Low profile design allows for compact and slim electronic devices.

Width (mm): 4 mm

Compact size enables easy integration into tight spaces within electronic devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specifically designed for efficient power management, ensuring stable and reliable performance of electronic devices.

Minimum Supply Voltage (Vsup): 3.9 V

Enables operation in low voltage conditions, improving energy efficiency.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering, ensuring a secure and reliable connection to the PCB.

Nominal Threshold Voltage (V): +3.8V

Provides a reference voltage level for accurate and precise power management.

Temperature Grade: INDUSTRIAL

Suitable for use in harsh industrial environments, where temperature fluctuations are common.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS regulations.

Switcher Config: BUCK

Efficient buck switching configuration helps in reducing power losses and improving energy efficiency.

Terminal Pitch: 0.5 mm

Close terminal pitch allows for high-density mounting on the PCB, saving valuable space.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level ensures reliability during storage and handling.

Maximum Supply Voltage (Vsup): 17 V

Supports a wide range of input voltages, making it versatile for different applications.

Technical Specifications

Power Management ICs HPA02150RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.8V

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

3.9 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

HPA02150RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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