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HPA02148DRZR

Texas Instruments

HPA02148DRZR by Texas Instruments

Texas Instruments' HPA02148DRZR is a Power Management IC with 12 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.7V to 5.5V and features a small outline package suitable for industrial applications requiring precise power supply management circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,487 parts In-Stock

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Digiode

USA . 288 parts In-Stock

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288

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 609 parts In-Stock

1+ parts

$6.500

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609

$6.500

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One Stop Electronics

USA . 284 parts In-Stock

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$6.500

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284

$6.500

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Parana Technologies

USA . 1,586 parts In-Stock

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$6.606

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$613.511

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$5.946

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1,586

$6.606

$613.511

$5.946

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DigiPath Technology Company

USA . 1,223 parts In-Stock

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$7.275

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$6.693

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1,223

$7.275

$6.693

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ChromeModa Solutions

Germany . 2,737 parts In-Stock

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$7.423

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$6.087

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2,737

$7.423

$6.087

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IDEA Electronic Components Group

UK . 681 parts In-Stock

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$7.423

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$6.681

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681

$7.423

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$6.681

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AZTECH Wire

Italy . 799 parts In-Stock

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$7.749

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799

$7.749

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Microchip USA

USA . 4,334 parts In-Stock

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$11.660

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$11.580

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$11.550

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$11.510

4,334

$11.660

$11.580

$11.550

$11.510

QUARKTWIN TECHNOLOGY LTD

USA . 10,230 parts In-Stock

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Corphita

USA . 4,548 parts In-Stock

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4,548

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience the superior quality and reliability of Texas Instruments with the HPA02148DRZR, a top-of-the-line Power Management IC designed to optimize performance in a variety of applications. With a focus on efficiency and precision, this product offers customers unmatched value and benefits. Whether you're looking to enhance power supply management or streamline your industrial processes, trust Texas Instruments to deliver cutting-edge solutions that meet your needs. Elevate your projects with the HPA02148DRZR and experience the difference that quality craftsmanship can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and helps in keeping the overall weight of the IC low.

Surface Mount: Yes

Being surface mountable makes it easier to integrate into circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V ensures compatibility with a wide range of devices and power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C allows this IC to function reliably in extreme cold conditions.

Technical Specifications

Power Management ICs HPA02148DRZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

HPA02148DRZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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