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HPA01216RHAR

Texas Instruments

HPA01216RHAR by Texas Instruments

Texas Instruments' HPA01216RHAR is a 40-terminal microprocessor circuit with 8192 RAM bytes. Operating b/w -40 to 85 °C, it has a supply voltage range of 2-3.6 V and features TIMER(4) peripherals. Ideal for industrial applications, this CMOS technology IC is surface-mountable in a square chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,569 parts In-Stock

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4,569

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Vyrian

USA . 3,282 parts In-Stock

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3,282

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 514 parts In-Stock

1+ parts

$9.825

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-

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514

$9.825

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Parana Technologies

USA . 824 parts In-Stock

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$15.056

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$15.469

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824

$15.056

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$15.469

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DigiPath Technology Company

USA . 561 parts In-Stock

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$16.579

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561

$16.579

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ChromeModa Solutions

Germany . 6,018 parts In-Stock

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$16.917

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$13.872

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6,018

$16.917

$13.872

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IDEA Electronic Components Group

UK . 21 parts In-Stock

1+ parts

$16.917

100+ parts

$16.071

1k+ parts

$15.225

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21

$16.917

$16.071

$15.225

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One Stop Electronics

USA . 1,516 parts In-Stock

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$29.000

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1,516

$29.000

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Ampacity Inc.

Singapore . 240 parts In-Stock

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$30.000

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240

$30.000

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Corohmni

South Africa . 2,431 parts In-Stock

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$72.134

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Component Stockers USA

USA . 350 parts In-Stock

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$99.990

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350

$99.990

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Corphita

USA . 4,611 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Enhance your electronic designs with the HPA01216RHAR by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This versatile microprocessor circuit offers a wide range of applications in the realm of Other Function uPs,uCs & Peripheral ICs. With its innovative technology and industrial-grade construction, this chip carrier delivers exceptional performance in a compact form factor. Experience the benefits of smooth operation, precise timing with 4 timers, and ample storage capacity with 8192 RAM bytes. Upgrade your projects today with the HPA01216RHAR and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and reliability for long-term use.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage:

3.6 V - Supports various power requirements for flexibility in application.

Package Shape:

SQUARE - Helps in compact design for space-saving solutions.

No. of Terminals:

40 - Offers a sufficient number of connections for versatile connectivity.

Package Style:

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Enhances thermal performance and overall efficiency.

Minimum Supply Voltage:

2 V - Allows for operation in low power situations.

Maximum Operating Temperature:

85 °C - Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides corrosion resistance and excellent conductivity.

Terminal Position:

QUAD - Facilitates easy installation and secure connection.

Maximum Seated Height:

1 mm - Contributes to a slim and sleek design.

Width:

6 mm - Compact size for efficient use of space on PCBs.

Peripherals:

TIMER(4) - Adds functionality for timekeeping and scheduling tasks.

Maximum Time At Peak ReflowTemperature (s):

30 - Ensures proper soldering during assembly process.

Peak Reflow Temperature °C:

260 - Supports high-temperature reflow soldering for reliability.

Length:

6 mm - Compact size for space-saving applications.

Temperature Grade:

INDUSTRIAL - Ideal for industrial environments with varying temperature conditions.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - Offers advanced processing capabilities for versatile applications.

RAM Bytes:

8192 - Sufficient memory capacity for data storage and processing.

Technology:

CMOS - Provides low power consumption and high-speed operation.

Terminal Form:

NO LEAD - Environmentally friendly and compliant with RoHS regulations.

Nominal Supply Voltage:

3 V - Standard voltage level compatible with many power sources.

Terminal Pitch:

0.5 mm - Fine pitch for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL):

3 - Resistant to moisture for reliable performance in various environments.

No. of I/O Lines:

23 - Offers multiple input and output channels for connectivity and communication.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs HPA01216RHAR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

23

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Peripherals:

TIMER(4)

Trade Compliance

HPA01216RHAR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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