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HPA01215RHAR

Texas Instruments

HPA01215RHAR by Texas Instruments

The Texas Instruments HPA01215RHAR is a MICROPROCESSOR CIRCUIT with 8192 RAM Bytes, operating at -40 to 85 °C. It features 23 I/O Lines, TIMER(4) peripherals, and a supply voltage range of 2-3.6 V. This IC is ideal for industrial applications requiring high-performance processing in a compact CHIP CARRIER package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,522 parts In-Stock

1+ parts

-

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5,522

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Digiode

USA . 1,039 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,039

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,296 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

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10k+ parts

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1,296

$6.000

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Corohmni

South Africa . 617 parts In-Stock

1+ parts

$15.004

100+ parts

-

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617

$15.004

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AZTECH Wire

Italy . 321 parts In-Stock

1+ parts

$19.811

100+ parts

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321

$19.811

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Parana Technologies

USA . 1,048 parts In-Stock

1+ parts

$34.019

100+ parts

-

1k+ parts

$139.522

10k+ parts

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1,048

$34.019

-

$139.522

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DigiPath Technology Company

USA . 544 parts In-Stock

1+ parts

$37.460

100+ parts

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544

$37.460

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IDEA Electronic Components Group

UK . 1,820 parts In-Stock

1+ parts

$38.224

100+ parts

$36.313

1k+ parts

$34.402

10k+ parts

-

1,820

$38.224

$36.313

$34.402

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ChromeModa Solutions

Germany . 1,153 parts In-Stock

1+ parts

$38.224

100+ parts

$31.344

1k+ parts

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1,153

$38.224

$31.344

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Corphita

USA . 188 parts In-Stock

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188

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Overview

Elevate your electronics with the HPA01215RHAR by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. This versatile microprocessor circuit offers unmatched performance in various applications, featuring 8192 bytes of RAM and 23 I/O lines for seamless functionality. From timers to peripherals, this chip carrier boasts industrial-grade quality and a compact, heat sink design that maximizes efficiency. Upgrade your projects with the premium advantages and value that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and improving overall reliability.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the circuit board and facilitates easier arrangement of components.

No. of Terminals: 40

Higher number of terminals allow for more connections and functionality, enabling the product to support a variety of peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile provides excellent thermal management and compact design for better performance.

Minimum Supply Voltage: 2 V

Lower minimum supply voltage ensures energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures reliable performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish offers excellent corrosion resistance and reliable electrical connections for long-term use.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit allows for complex data processing and control capabilities, making the product suitable for advanced applications.

RAM Bytes: 8192

Large RAM capacity enables efficient data storage and processing, enhancing the product's performance in memory-intensive tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs HPA01215RHAR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

23

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Peripherals:

TIMER(4)

Trade Compliance

HPA01215RHAR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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