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HPA01140ATPHDRMQ1

Texas Instruments

HPA01140ATPHDRMQ1 by Texas Instruments

Texas Instruments' HPA01140ATPHDRMQ1 is an audio amplifier IC with 4 channels, 116W output power, and 32dB gain. It operates in industrial temperature range (-40 to 105°C) and supports a supply voltage range of 8-22V. Ideal for automotive applications due to AEC-Q100 screening level and compact square package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,728 parts In-Stock

1+ parts

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9,728

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Digiode

USA . 4,313 parts In-Stock

1+ parts

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4,313

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 507 parts In-Stock

1+ parts

$2.899

100+ parts

-

1k+ parts

$3.393

10k+ parts

-

507

$2.899

-

$3.393

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ChromeModa Solutions

Germany . 6,516 parts In-Stock

1+ parts

$3.257

100+ parts

$2.671

1k+ parts

-

10k+ parts

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6,516

$3.257

$2.671

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IDEA Electronic Components Group

UK . 1,407 parts In-Stock

1+ parts

$3.257

100+ parts

-

1k+ parts

$2.931

10k+ parts

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1,407

$3.257

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$2.931

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AZTECH Wire

Italy . 270 parts In-Stock

1+ parts

$14.508

100+ parts

-

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270

$14.508

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One Stop Electronics

USA . 1,615 parts In-Stock

1+ parts

$15.800

100+ parts

-

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1,615

$15.800

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Microchip USA

USA . 2,147 parts In-Stock

1+ parts

$53.920

100+ parts

$53.150

1k+ parts

$52.760

10k+ parts

$52.380

2,147

$53.920

$53.150

$52.760

$52.380

Corphita

USA . 1,626 parts In-Stock

1+ parts

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1,626

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DigiPath Technology Company

USA . 1,105 parts In-Stock

1+ parts

-

100+ parts

$2.937

1k+ parts

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10k+ parts

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1,105

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$2.937

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Overview

Elevate your audio experience with the HPA01140ATPHDRMQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This audio amplifier is perfect for a wide range of applications, providing unparalleled sound quality and performance. With its sleek design and advanced features, this amplifier offers customers exceptional value and benefits. Upgrade your audio system today with the HPA01140ATPHDRMQ1 and enjoy an elevated listening experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design of the amplifier.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on circuit boards.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this product is designed specifically for amplifying sound signals, ensuring high-quality audio output.

Nominal Output Power: 116 W

With a high nominal output power of 116W, this amplifier can deliver strong and clear audio signals.

No. of Channels: 4

Having 4 channels allows for multiple audio inputs to be amplified simultaneously, making it suitable for multi-speaker setups or surround sound systems.

Maximum Supply Voltage (Vsup): 22 V

The high maximum supply voltage allows for greater headroom and power handling, making it suitable for a wide range of audio equipment.

Technical Specifications

Audio & Video Amplifiers HPA01140ATPHDRMQ1 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

Gain:

32 dB

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

116 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

HPA01140ATPHDRMQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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