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TDA2003HLG

STMicroelectronics

TDA2003HLG by STMicroelectronics

TDA2003HLG by STMicroelectronics is a Class AB audio amplifier with 5 terminals in a rectangular package. It features bipolar technology, zig-zag terminal position, and flange mount style. Ideal for audio applications requiring efficient amplification in through-hole mounting setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 143,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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143,200

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-

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Digiode

USA . 3,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,673

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Anansix

USA . 1,021 parts In-Stock

1+ parts

-

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-

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1,021

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-

-

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Vyrian

USA . 735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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735

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Nova Conductors

Japan . 91 parts In-Stock

1+ parts

-

100+ parts

-

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91

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 249 parts In-Stock

1+ parts

$2.563

100+ parts

-

1k+ parts

-

10k+ parts

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249

$2.563

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-

-

Corohmni

South Africa . 388 parts In-Stock

1+ parts

$3.040

100+ parts

-

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388

$3.040

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IDEA Electronic Components Group

UK . 2,320 parts In-Stock

1+ parts

$3.115

100+ parts

-

1k+ parts

$2.804

10k+ parts

-

2,320

$3.115

-

$2.804

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MKK Technologies

India . 1,320 parts In-Stock

1+ parts

$5.858

100+ parts

-

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1,320

$5.858

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DigiPath Technology Company

USA . 1,320 parts In-Stock

1+ parts

$5.858

100+ parts

-

1k+ parts

-

10k+ parts

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1,320

$5.858

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-

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AZTECH Wire

Italy . 307 parts In-Stock

1+ parts

$7.735

100+ parts

-

1k+ parts

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307

$7.735

-

-

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Ampacity Inc.

Singapore . 670 parts In-Stock

1+ parts

$17.800

100+ parts

-

1k+ parts

-

10k+ parts

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670

$17.800

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-

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Kepictronics

USA . 22,000 parts In-Stock

1+ parts

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100+ parts

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22,000

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Continental Prestige Electronics

USA . 6,545 parts In-Stock

1+ parts

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6,545

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Corphita

USA . 4,456 parts In-Stock

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4,456

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Argo Parts USA

USA . 2,844 parts In-Stock

1+ parts

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2,844

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Parana Technologies

USA . 912 parts In-Stock

1+ parts

-

100+ parts

$3.725

1k+ parts

-

10k+ parts

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912

-

$3.725

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Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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40

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Overview

Unleash the power of impeccable audio amplification with the TDA2003HLG by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers top-quality products that exceed expectations. Ideal for a wide range of applications in audio and video systems, this class AB audio amplifier offers unparalleled value, bringing crystal-clear sound and exceptional performance to customers. Upgrade your audio experience with the TDA2003HLG and immerse yourself in superior sound quality like never before.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and stacking in electronic devices, saving space and providing a sleek and compact design.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB audio amplifiers are known for their high efficiency and low distortion, making them ideal for high-quality music and audio applications.

No. of Terminals: 5

Having 5 terminals allows for more flexibility in connecting various components and peripherals, enhancing the functionality of the audio amplifier.

Package Style (Meter): FLANGE MOUNT

The flange mount package style makes it easy to securely mount the amplifier to a surface, providing stability and reducing the risk of damage during operation.

Terminal Position: ZIG-ZAG

The zig-zag terminal position helps in efficient routing of connections, reducing the chance of signal interference and improving overall performance of the amplifier.

Technology: BIPOLAR

Bipolar technology offers higher power and lower noise compared to other technologies, resulting in improved audio quality and reliability of the amplifier.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy and secure soldering of the amplifier to a circuit board, ensuring a strong connection and stable operation.

Technical Specifications

Audio & Video Amplifiers TDA2003HLG attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-XZFM-T5

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Package Body Material:

UNSPECIFIED

Package Code:

ZFM

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Form:

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA2003HLG General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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