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HPA00577DGNR

Texas Instruments

HPA00577DGNR by Texas Instruments

Texas Instruments' HPA00577DGNR is an 8-terminal audio amplifier IC with 0.15W output power. Operating b/w -40 to 85°C, it supports a supply voltage range of 2.5-5.5V and offers a nominal bandwidth of 0.02 kHz. Ideal for industrial applications requiring compact, surface-mount solutions with dual terminals in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,729 parts In-Stock

1+ parts

-

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-

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5,729

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-

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Digiode

USA . 2,142 parts In-Stock

1+ parts

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-

1k+ parts

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2,142

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,694 parts In-Stock

1+ parts

$2.769

100+ parts

-

1k+ parts

$3.253

10k+ parts

-

1,694

$2.769

-

$3.253

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DigiPath Technology Company

USA . 750 parts In-Stock

1+ parts

$3.049

100+ parts

$2.805

1k+ parts

-

10k+ parts

-

750

$3.049

$2.805

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ChromeModa Solutions

Germany . 1,502 parts In-Stock

1+ parts

$3.111

100+ parts

$2.551

1k+ parts

-

10k+ parts

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1,502

$3.111

$2.551

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IDEA Electronic Components Group

UK . 875 parts In-Stock

1+ parts

$3.111

100+ parts

-

1k+ parts

$2.800

10k+ parts

-

875

$3.111

-

$2.800

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AZTECH Wire

Italy . 527 parts In-Stock

1+ parts

$13.013

100+ parts

-

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10k+ parts

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527

$13.013

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One Stop Electronics

USA . 1,481 parts In-Stock

1+ parts

$14.800

100+ parts

-

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1,481

$14.800

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Corphita

USA . 112 parts In-Stock

1+ parts

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112

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Overview

Experience unparalleled audio quality with the HPA00577DGNR by Texas Instruments, a leading manufacturer in the industry. This audio amplifier is perfect for a wide range of applications, delivering exceptional performance and reliability. With its compact design and advanced technology, this product offers unmatched value and benefits to customers looking for top-notch sound amplification. Upgrade your audio experience today with the HPA00577DGNR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes this amplifier lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly onto circuit boards, saving time and space during production.

General IC Type: AUDIO AMPLIFIER

Being specifically designed for audio amplification, this amplifier provides high-quality sound output for audio applications such as speakers or headphones.

Nominal Output Power: 0.15 W

With a nominal output power of 0.15W, this amplifier is suitable for low-power audio applications, such as small speakers or headphones.

Nominal Bandwidth: 0.02 kHz

The nominal bandwidth of 0.02 kHz ensures that this amplifier can accurately reproduce audio signals within a narrow frequency range, making it suitable for specific audio applications.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this amplifier can work efficiently with a wide range of power sources and deliver consistent performance.

Technical Specifications

Audio & Video Amplifiers HPA00577DGNR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.15 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

HPA00577DGNR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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