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HPA01086YFFR

Texas Instruments

HPA01086YFFR by Texas Instruments

Texas Instruments' HPA01086YFFR is a 9-terminal audio amplifier with a nominal output power of 3.24W and max supply voltage of 5.5V. With a package style of grid array, it's ideal for industrial applications requiring high-quality audio amplification in compact spaces at temperatures ranging from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,188 parts In-Stock

1+ parts

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5,188

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Digiode

USA . 3,915 parts In-Stock

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3,915

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Nova Conductors

Japan . 31 parts In-Stock

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31

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 185 parts In-Stock

1+ parts

$2.917

100+ parts

-

1k+ parts

$3.416

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185

$2.917

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$3.416

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ChromeModa Solutions

Germany . 6,031 parts In-Stock

1+ parts

$3.277

100+ parts

$2.687

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-

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6,031

$3.277

$2.687

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IDEA Electronic Components Group

UK . 1,408 parts In-Stock

1+ parts

$3.277

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-

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$2.949

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1,408

$3.277

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$2.949

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Ampacity Inc.

Singapore . 705 parts In-Stock

1+ parts

$5.800

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705

$5.800

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$9.659

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766

$9.659

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One Stop Electronics

USA . 303 parts In-Stock

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$13.800

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303

$13.800

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Microchip USA

USA . 2,282 parts In-Stock

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2,282

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DigiPath Technology Company

USA . 2,104 parts In-Stock

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$2.955

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2,104

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$2.955

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Corphita

USA . 1,553 parts In-Stock

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1,553

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Elevate your audio and video experience with the HPA01086YFFR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality audio amplifiers like this one that provide crystal-clear sound and seamless performance. Perfect for a wide range of applications, this amplifier offers customers exceptional value and benefits, from its compact design to its reliable performance. Transform your audio setup with the HPA01086YFFR and enjoy unparalleled sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the components inside the amplifier, ensuring a longer lifespan.

Nominal Output Power: 3.24 W

With a decent output power of 3.24 W, this amplifier can effectively drive audio signals to produce clear and loud sound.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement of 2.5 V allows for efficient power consumption and flexibility in powering the amplifier.

Nominal Bandwidth: 0.02 kHz

With a nominal bandwidth of 0.02 kHz, this amplifier is suitable for audio applications with low-frequency signals such as voice recordings or background music.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the amplifier can operate reliably in harsh environmental conditions, making it suitable for a wide range of applications.

Technical Specifications

Audio & Video Amplifiers HPA01086YFFR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

R-PBGA-B9

JESD-609 Code:

e1

Length:

1.214 mm

Moisture Sensitivity Level (MSL):

1

Nominal Noise Figure:

95 dB

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3.24 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.16 mm

Trade Compliance

HPA01086YFFR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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