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HPA00874RTER

Texas Instruments

HPA00874RTER by Texas Instruments

Texas Instruments HPA00874RTER is a 16-terminal audio amplifier chip carrier with a gain of 36 dB. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. With a supply voltage range of 2.3-5.5V, it's ideal for compact audio and video amplification in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,086

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-

-

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Digiode

USA . 3,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,468

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,045 parts In-Stock

1+ parts

$2.328

100+ parts

-

1k+ parts

$2.827

10k+ parts

-

2,045

$2.328

-

$2.827

-

DigiPath Technology Company

USA . 707 parts In-Stock

1+ parts

$2.564

100+ parts

-

1k+ parts

-

10k+ parts

-

707

$2.564

-

-

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$2.616

100+ parts

-

1k+ parts

$2.354

10k+ parts

-

1,373

$2.616

-

$2.354

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ChromeModa Solutions

Germany . 604 parts In-Stock

1+ parts

$2.616

100+ parts

$2.145

1k+ parts

-

10k+ parts

-

604

$2.616

$2.145

-

-

AZTECH Wire

Italy . 831 parts In-Stock

1+ parts

$17.799

100+ parts

-

1k+ parts

-

10k+ parts

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831

$17.799

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-

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One Stop Electronics

USA . 287 parts In-Stock

1+ parts

$20.800

100+ parts

-

1k+ parts

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287

$20.800

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-

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Microchip USA

USA . 4,283 parts In-Stock

1+ parts

-

100+ parts

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4,283

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Corphita

USA . 2,492 parts In-Stock

1+ parts

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2,492

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Overview

Elevate your audio experience with the HPA00874RTER by Texas Instruments. Known for their high-quality manufacturing, Texas Instruments delivers top-of-the-line audio amplifiers perfect for a variety of applications. Whether you're looking to enhance your home entertainment system or upgrade your car audio, this product offers unmatched value, benefits, and advantages. With its compact design and advanced features, the HPA00874RTER is the perfect choice for customers who demand superior sound quality. Elevate your audio game today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PlASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, perfect for portable audio amplifier applications.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and enabling automated assembly processes.

Nominal Output Power: 0.025 W

Although the output power is low, it is suitable for driving small speakers or headphones, making it ideal for personal audio devices.

Width: 3 mm

Compact width of 3mm makes this audio amplifier chip ideal for applications where space is limited, such as in mobile devices or wearables.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage requirement of 2.3V makes this amplifier energy-efficient and suitable for battery-powered devices.

Gain: 36 dB

High gain of 36dB provides ample amplification for audio signals, ensuring clear and loud sound output.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5V allows for flexibility in powering the amplifier without exceeding its operating limits, ensuring reliable performance.

Technical Specifications

Audio & Video Amplifiers HPA00874RTER attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

Gain:

36 dB

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.025 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

HPA00874RTER General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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