Loading...

HPA00190DR

Texas Instruments

HPA00190DR by Texas Instruments

Texas Instruments HPA00190DR is an audio amplifier IC with 3 channels, BICMOS technology, and gain of 6 dB. It operates in industrial temperature range (-40 to 85°C) with supply voltage from 3V to 5V. Ideal for audio and video amplification applications due to its small outline package and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Digiode

USA . 320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

320

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 173 parts In-Stock

1+ parts

$0.318

100+ parts

-

1k+ parts

$1.554

10k+ parts

-

173

$0.318

-

$1.554

-

DigiPath Technology Company

USA . 2,027 parts In-Stock

1+ parts

$0.350

100+ parts

$0.322

1k+ parts

-

10k+ parts

-

2,027

$0.350

$0.322

-

-

IDEA Electronic Components Group

UK . 1,681 parts In-Stock

1+ parts

$0.357

100+ parts

-

1k+ parts

$0.321

10k+ parts

-

1,681

$0.357

-

$0.321

-

ChromeModa Solutions

Germany . 1,456 parts In-Stock

1+ parts

$0.357

100+ parts

$0.293

1k+ parts

-

10k+ parts

-

1,456

$0.357

$0.293

-

-

AZTECH Wire

Italy . 554 parts In-Stock

1+ parts

$11.541

100+ parts

-

1k+ parts

-

10k+ parts

-

554

$11.541

-

-

-

One Stop Electronics

USA . 1,151 parts In-Stock

1+ parts

$11.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,151

$11.800

-

-

-

Corphita

USA . 2,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,725

-

-

-

-

Overview

Looking to amplify your audio and video projects with top-quality components? Look no further than the HPA00190DR by Texas Instruments. With a reputation for excellence in manufacturing, this audio amplifier offers crystal-clear sound and seamless performance in a compact package. Ideal for a wide range of applications, this versatile amplifier provides value and reliability that customers can trust. Upgrade your projects today with the HPA00190DR and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resilience, making the amplifier resistant to impact and environmental factors.

No. of Functions: 3

Having 3 functions allows for more versatility in audio amplification capabilities, catering to a wider range of audio needs.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio applications, ensuring high-quality sound reproduction and efficient amplification.

Maximum Operating Temperature: 85 °C

Operates efficiently even at high temperatures, ensuring reliable performance in various environmental conditions.

Technology: BICMOS

Utilizing Bipolar-CMOS technology combines the advantages of both technologies, providing high performance and low power consumption.

Technical Specifications

Audio & Video Amplifiers HPA00190DR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

8.5 kHz

General IC Type:

Gain:

6 dB

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

24 mA

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

HPA00190DR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19