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GC6016IZEV

Texas Instruments

GC6016IZEV by Texas Instruments

GC6016IZEV by Texas Instruments is a DSP with 16-bit external data bus width, 310 MHz max clock frequency, and 484 terminals. It is used in digital signal processing applications requiring low power mode and features a CMOS technology with a max supply voltage of 1.15 V.

Median Price

$75.010

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44 parts In-Stock

1+ parts

-

100+ parts

$75.010

1k+ parts

$67.120

10k+ parts

$63.170

44

-

$75.010

$67.120

$63.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,772 parts In-Stock

1+ parts

$79.182

100+ parts

-

1k+ parts

-

10k+ parts

-

2,772

$79.182

-

-

-

DigiKey Marketplace

USA . 44 parts In-Stock

1+ parts

$86.680

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$86.680

-

-

-

Vyrian

USA . 3,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,540

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,954 parts In-Stock

1+ parts

$22.203

100+ parts

-

1k+ parts

$22.851

10k+ parts

-

1,954

$22.203

-

$22.851

-

DigiPath Technology Company

USA . 288 parts In-Stock

1+ parts

$24.448

100+ parts

$22.492

1k+ parts

-

10k+ parts

-

288

$24.448

$22.492

-

-

ChromeModa Solutions

Germany . 2,064 parts In-Stock

1+ parts

$24.947

100+ parts

$20.457

1k+ parts

-

10k+ parts

-

2,064

$24.947

$20.457

-

-

IDEA Electronic Components Group

UK . 170 parts In-Stock

1+ parts

$24.947

100+ parts

$23.700

1k+ parts

$22.452

10k+ parts

-

170

$24.947

$23.700

$22.452

-

Native Components

USA . 851 parts In-Stock

1+ parts

$26.563

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$26.563

-

-

-

Northwest PG Solutions

USA . 782 parts In-Stock

1+ parts

$29.219

100+ parts

$26.297

1k+ parts

-

10k+ parts

-

782

$29.219

$26.297

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-

Corohmni

South Africa . 641 parts In-Stock

1+ parts

$74.310

100+ parts

-

1k+ parts

-

10k+ parts

-

641

$74.310

-

-

-

Corphita

USA . 4,613 parts In-Stock

1+ parts

$75.015

100+ parts

-

1k+ parts

-

10k+ parts

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4,613

$75.015

-

-

-

A-Z Elektronik GmbH

Germany . 420 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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420

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Overview

Elevate your digital signal processing capabilities with the Texas Instruments GC6016IZEV. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and performance. The GC6016IZEV falls under the category of Digital Signal Processors, offering a wide range of applications for various industries. With its advanced technology and innovative features, this product provides exceptional value and benefits to customers looking for efficient and high-performing solutions. Upgrade your systems with the Texas Instruments GC6016IZEV and experience the difference in quality and efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mounting allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.15 V

Operating within this voltage range ensures safe and reliable performance.

Address Bus Width: 8

A wide address bus allows for efficient data processing and communication within the system.

Package Shape: SQUARE

A square package shape saves space and allows for efficient placement on circuit boards.

Power Supplies (V): 1.2, 1.8, 3.3

Having multiple power supply options gives flexibility in designing and optimizing power consumption.

No. of Terminals: 484

With a high number of terminals, the product can support complex connections and functions.

Package Style (Meter): GRID ARRAY

A grid array package style allows for high-density mounting and efficient heat dissipation.

Minimum Supply Voltage: 1.05 V

Having a minimum supply voltage ensures stability and prevents damage due to under-voltage.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position makes soldering and mounting easier and more convenient.

Maximum Seated Height: 2.48 mm

A low seated height allows for compact and slim designs of electronic devices.

Width: 23 mm

A moderate width provides a balance between space efficiency and easy handling.

Boundary Scan: YES

Boundary scan capability helps with testing and debugging during product development and production.

External Data Bus Width: 16

A wide external data bus width allows for high-speed data transfer and processing.

Maximum Clock Frequency: 310 MHz

The high clock frequency enables fast and efficient signal processing and computation.

Maximum Time At Peak Reflow Temperature (s): 30

This spec ensures that the product can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature tolerance ensures reliable soldering and assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture improves data flow and efficiency within the processor.

Length: 23 mm

A moderate length allows for versatile placement and integration in electronic systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supporting multiple peripheral IC types enhances the compatibility and functionality of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 1.1 V

Having a steady nominal supply voltage ensures consistent and stable performance.

Terminal Pitch: 1 mm

A 1mm terminal pitch allows for compact and efficient placement on circuit boards.

Format: FLOATING POINT

Supporting floating-point format enhances the accuracy and efficiency of mathematical operations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during handling and storage.

Low Power Mode: YES

Low power mode provides energy-saving options for efficient operation and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) GC6016IZEV attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

8

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

310 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

484

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.48 mm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

GC6016IZEV Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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