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EP1830-25CFN

Texas Instruments

EP1830-25CFN by Texas Instruments

EP1830-25CFN by Texas Instruments is a CMOS OT PLD with 48 macro cells, 28 ns propagation delay, and 5.25 V max supply voltage. Ideal for applications requiring programmable logic devices in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,647 parts In-Stock

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Digiode

USA . 2,025 parts In-Stock

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ECAB

Sweden . 300 parts In-Stock

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300

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Native Components

USA . 187 parts In-Stock

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$2.070

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Northwest PG Solutions

USA . 837 parts In-Stock

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$2.277

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AZTECH Wire

Italy . 345 parts In-Stock

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$6.861

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One Stop Electronics

USA . 171 parts In-Stock

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Parana Technologies

USA . 676 parts In-Stock

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DigiPath Technology Company

USA . 1,294 parts In-Stock

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$138.092

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ChromeModa Solutions

Germany . 2,830 parts In-Stock

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$125.594

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IDEA Electronic Components Group

UK . 479 parts In-Stock

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Corphita

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Assy Fe

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Overview

Upgrade your electronic designs with the EP1830-25CFN by Texas Instruments! Crafted with precision using high-quality materials, this Programmable Logic Device offers unmatched performance and reliability. Ideal for a wide range of applications, from consumer electronics to industrial automation, this PLD is sure to meet your project requirements. With fast propagation delays and a multitude of I/O lines, this chip carrier-style device provides exceptional value and flexibility. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, ideal for portability and long-term use.

Propagation Delay: 28 ns

Low propagation delay ensures quick response time and efficient performance in signal processing applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and facilitating automated assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of power sources and ensures reliable operation.

No. of Macro Cells: 48

Having 48 macro cells provides flexibility in implementing complex logic functions, making it suitable for a variety of design requirements.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Package Shape: SQUARE

The square package shape facilitates efficient placement on the circuit board, maximizing space utilization and enabling compact designs.

Form Of Terminal: J BEND

J bend terminals allow for secure and reliable connections, reducing the risk of disconnection or signal loss.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying integration into existing systems.

Power Supplies (V): 5

The availability of multiple power supply options at 5V provides flexibility in meeting different voltage requirements within the same design.

No. of Terminals: 68

Having 68 terminals allows for versatile connectivity options, accommodating various input/output configurations for diverse applications.

Programmable IC Type: OT PLD

The OT PLD type offers programmable logic capabilities, enabling customization and reconfiguration of logic functions as needed.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers efficient heat dissipation and protection for the device, ensuring reliable performance under varying operating conditions.

Output Function: MACROCELL

The macrocell output function allows for versatile logic operations, facilitating the implementation of complex functions with ease.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage of 4.75V ensures operation under varying power conditions, enhancing the device's reliability and robustness.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C enables the device to withstand elevated temperatures without performance degradation, suitable for industrial environments.

Pitch Of Terminal: 1.27 mm

The terminal pitch of 1.27mm allows for easy connection with standard sockets and connectors, facilitating integration into existing systems.

Organization: 12 DEDICATED INPUTS, 48 I/O

The organization with dedicated inputs and I/O lines offers flexibility in configuring inputs and outputs, optimizing functionality for specific application requirements.

No. of Dedicated Inputs: 12

Having 12 dedicated inputs allows for direct input connections without interference, ensuring accurate signal processing and reliable operation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance even in cold environments, making the device suitable for a wide range of applications.

Position Of Terminal: QUAD

The quad terminal configuration provides stable and secure connections, minimizing signal interference and enhancing the overall reliability of the device.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57mm allows for compact installation in space-constrained environments, enabling versatile deployment options.

Width: 24.2316 mm

The compact width of 24.2316mm facilitates efficient placement on the circuit board, enabling dense packing and optimized layout designs.

Length: 24.2316 mm

The length of 24.2316mm provides a balanced form factor for convenient integration and compatibility with standard board dimensions.

No. of I/O Lines: 48

Having 48 I/O lines allows for versatile connectivity options, supporting a wide range of input/output configurations for diverse applications.

Grading Of Temperature: COMMERCIAL

The commercial temperature grading ensures stable performance in typical operating conditions, making the device suitable for commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) EP1830-25CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

12 Dedicated Inputs, 48 I/O

Output Function:

Macrocell

No. of Macro Cells:

48

No. of Dedicated Inputs:

12

No. of I/O Lines:

48

Propagation Delay:

28 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

F_Max for 12-bit counter application is 40 MHz; Labs interconnected by PIA; 4 Labs; 48 Macrocells

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC68,1.0SQ

Width:

24.2316 mm

Length:

24.2316 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

68

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J68

JTAG Boundary Scan Test:

No

Qualified:

No

Trade Compliance

EP1830-25CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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