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EP1830-20CFN

Texas Instruments

EP1830-20CFN by Texas Instruments

EP1830-20CFN by Texas Instruments is a CMOS OT PLD with 48 macro cells, 22 ns propagation delay, and 5.25 V max supply voltage. Ideal for applications requiring programmable logic devices in commercial-grade environments with surface mount capability and 12 dedicated inputs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,616 parts In-Stock

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Digiode

USA . 4,357 parts In-Stock

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Northwest PG Solutions

USA . 2,194 parts In-Stock

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$2.553

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AZTECH Wire

Italy . 557 parts In-Stock

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$10.555

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One Stop Electronics

USA . 1,014 parts In-Stock

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$17.000

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Parana Technologies

USA . 783 parts In-Stock

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$160.708

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DigiPath Technology Company

USA . 289 parts In-Stock

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$176.960

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$162.803

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289

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$162.803

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ChromeModa Solutions

Germany . 4,777 parts In-Stock

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$180.571

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$148.068

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IDEA Electronic Components Group

UK . 1,532 parts In-Stock

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$180.571

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$162.514

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Corphita

USA . 3,248 parts In-Stock

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Native Components

USA . 3 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the EP1830-20CFN by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile Programmable Logic Device (PLD) is perfect for a wide range of applications, offering lightning-fast propagation delay, high reliability, and easy surface mounting. With 48 macro cells and an array of inputs/outputs, this chip carrier-style device is designed to deliver superior performance and efficiency. Experience the advantage of seamless integration, precise output function, and robust construction in a compact package that maximizes value and functionality for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various applications.

Propagation Delay: 22 ns

Low propagation delay ensures fast response times and efficient operation.

Surface Mount: YES

Surface mount capability allows for easy installation and compact designs.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage tolerance provides flexibility in power supply options.

No. of Macro Cells: 48

Having 48 macro cells allows for complex logic functions to be implemented effectively.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall product performance.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and integration.

Form Of Terminal: J BEND

J bend terminals provide secure connections and ease of soldering.

Nominal Supply Voltage (V): 5

Nominal supply voltage of 5V is standard and widely supported in many applications.

Power Supplies (V): 5

Having consistent power supplies at 5V ensures stable operation and compatibility.

No. of Terminals: 68

Having 68 terminals allows for multiple connection options and flexibility in circuit design.

Programmable IC Type: OT PLD

OT PLD programming offers versatility and customization for various logic functions.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides compactness and efficient heat dissipation.

Output Function: MACROCELL

Macrocell output function allows for complex logic operations and control strategies.

Minimum Supply Voltage: 4.75 V

Higher minimum supply voltage tolerance ensures stable operation even under varying voltage conditions.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliability in various environmental conditions.

Pitch Of Terminal: 1.27 mm

Standard pitch of terminals allows for easy connection and compatibility with common PCB layouts.

Organization: 12 DEDICATED INPUTS, 48 I/O

Organized with dedicated inputs and I/O lines for efficient signal processing and control.

No. of Dedicated Inputs: 12

Having dedicated inputs allows for specific control and monitoring functions to be implemented effectively.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in cold environments.

Position Of Terminal: QUAD

Quad terminal position provides stability and efficient signal transmission.

Maximum Seated Height: 4.57 mm

Low maximum seated height allows for compact and space-saving PCB designs.

Width: 24.2316 mm

Standard width provides compatibility with various PCB layouts and enclosures.

Length: 24.2316 mm

Standard length allows for easy integration and placement in PCB designs.

No. of I/O Lines: 48

Having 48 I/O lines allows for versatile connectivity and external communication options.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures reliability and performance in standard operating environments.

Technical Specifications

Programmable Logic Devices (PLD) EP1830-20CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

12 Dedicated Inputs, 48 I/O

Output Function:

Macrocell

No. of Macro Cells:

48

No. of Dedicated Inputs:

12

No. of I/O Lines:

48

Propagation Delay:

22 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

F_Max for 12-bit counter application is 50 MHz; Labs interconnected by PIA; 4 Labs; 48 Macrocells

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC68,1.0SQ

Width:

24.2316 mm

Length:

24.2316 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

68

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J68

JTAG Boundary Scan Test:

No

Qualified:

No

Trade Compliance

EP1830-20CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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