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EP1830-30CFN

Texas Instruments

EP1830-30CFN by Texas Instruments

EP1830-30CFN by Texas Instruments is a CMOS PLD with 48 macro cells, 34 ns propagation delay, and 5.25 V max supply voltage. Ideal for applications requiring OT PLDs in commercial environments due to its 12 dedicated inputs and 48 I/O lines in a square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,214 parts In-Stock

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8,214

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Digiode

USA . 4,570 parts In-Stock

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4,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 173 parts In-Stock

1+ parts

$0.276

100+ parts

-

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$0.265

173

$0.276

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$0.265

Northwest PG Solutions

USA . 484 parts In-Stock

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$0.304

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-

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$0.268

484

$0.304

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$0.268

AZTECH Wire

Italy . 392 parts In-Stock

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$16.335

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392

$16.335

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One Stop Electronics

USA . 1,380 parts In-Stock

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$23.000

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1,380

$23.000

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Parana Technologies

USA . 81 parts In-Stock

1+ parts

$119.605

100+ parts

$11,107.168

1k+ parts

$107.645

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81

$119.605

$11,107.168

$107.645

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DigiPath Technology Company

USA . 1,756 parts In-Stock

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$131.700

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1,756

$131.700

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ChromeModa Solutions

Germany . 327 parts In-Stock

1+ parts

$134.388

100+ parts

$110.198

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327

$134.388

$110.198

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IDEA Electronic Components Group

UK . 130 parts In-Stock

1+ parts

$134.388

100+ parts

$127.669

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$120.949

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130

$134.388

$127.669

$120.949

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Corphita

USA . 3,676 parts In-Stock

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Overview

Enhance your electronic projects with the EP1830-30CFN by Texas Instruments, a top-tier manufacturer of cutting-edge Programmable Logic Devices. Ideal for a wide range of applications, this PLD offers unparalleled quality and reliability. With its advanced CMOS technology and 48 macro cells, this chip carrier packaged device provides fast propagation delay and versatile I/O capabilities. Whether you're a seasoned engineer or a DIY enthusiast, the EP1830-30CFN delivers exceptional value and performance, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Macro Cells: 48

Higher number of macro cells allow for complex programmable logic functions to be implemented, making the product versatile for various applications.

Technology Used: CMOS

CMOS technology offers low power consumption, making the product energy efficient and suitable for battery-powered devices.

No. of Terminals: 68

Having a high number of terminals allows for greater connectivity options and flexibility in design.

Output Function: MACROCELL

The use of macrocells enables the user to implement logic functions within the device, providing customizability and control over the output.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can perform reliably even in harsh environmental conditions or applications that generate heat.

Technical Specifications

Programmable Logic Devices (PLD) EP1830-30CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

12 Dedicated Inputs, 48 I/O

Output Function:

Macrocell

No. of Macro Cells:

48

No. of Dedicated Inputs:

12

No. of I/O Lines:

48

Propagation Delay:

34 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

F_Max for 12-bit counter applicationsIS 33.3 MHz; Labs interconnected by PIA; 4 Labs; 48 Macrocells

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC68,1.0SQ

Width:

24.2316 mm

Length:

24.2316 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

68

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J68

JTAG Boundary Scan Test:

No

Qualified:

No

Trade Compliance

EP1830-30CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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