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EP1810LC-35

Texas Instruments

EP1810LC-35 by Texas Instruments

EP1810LC-35 by Texas Instruments is a CMOS PLD with 48 macro cells, 40 ns propagation delay, and 5.25 V max supply voltage. Ideal for applications requiring high-speed processing up to 40 MHz in commercial temperature environments.

Median Price

$157.320

Lifecycle Status

Suppliers In-Stock

15

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1k+

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Rochester

USA . 1,385 parts In-Stock

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$157.320

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$147.880

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$138.440

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DigiKey

USA . 1,385 parts In-Stock

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Digiode

USA . 1,140 parts In-Stock

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$173.964

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Vyrian

USA . 1,187 parts In-Stock

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DigiKey Marketplace

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Chip Stock

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Bristol Electronics

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Digital Electronic Gebert Verwaltungs UG

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MRC Electronics

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North Shore Components

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J & M Industries LLC

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Atlantic Semiconductor

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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Modulus Dynamics

Lithuania . 1,171 parts In-Stock

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$124.116

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$124.116

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One Stop Electronics

USA . 1,059 parts In-Stock

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$155.650

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Parana Technologies

USA . 223 parts In-Stock

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$160.153

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Corphita

USA . 5,331 parts In-Stock

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$164.808

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DigiPath Technology Company

USA . 1,975 parts In-Stock

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$176.348

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$162.240

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ChromeModa Solutions

Germany . 3,677 parts In-Stock

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$179.947

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$147.557

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

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$179.947

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$170.950

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$161.952

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Corohmni

South Africa . 177 parts In-Stock

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Texas Native Microelectronics

USA . 200 parts In-Stock

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$185.691

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$163.408

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Kenton Components

USA . 77 parts In-Stock

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$222.829

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$213.916

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$207.231

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$196.090

77

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$213.916

$207.231

$196.090

Semicontronic

India . 1,083 parts In-Stock

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$338.770

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$330.301

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$328.607

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Qasali Group International

UK . 858 parts In-Stock

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$501.366

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$481.311

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QUARKTWIN TECHNOLOGY LTD

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Northwest PG Solutions

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Alle Elektronik GmbH

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Glotronic Ltd.

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MARBEL Systems

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Supply Digital

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Microchip USA

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Native Components

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A-Z Elektronik GmbH

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Metaverse IC Inc.

Canada . 413 parts In-Stock

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RC Electronics

USA . 298 parts In-Stock

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$178.470

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$164.870

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GreenTree Electronics

Israel . 44 parts In-Stock

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Assy Fe

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Overview

Unlock the power of cutting-edge technology with the EP1810LC-35 by Texas Instruments. Manufactured with precision and expertise, this Programmable Logic Device (PLD) offers unmatched performance and reliability for a wide range of applications. Whether you're designing complex circuitry or developing innovative solutions, this PLD delivers exceptional value, flexibility, and efficiency. Elevate your projects to new heights with the EP1810LC-35 and experience the advantages of Texas Instruments' superior quality and innovation firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material ensures the product is suitable for various applications and environments.

Propagation Delay: 40 ns

The low propagation delay ensures fast signal processing, making this product ideal for time-sensitive applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration onto circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage provides flexibility and compatibility with a wide range of systems and devices.

No. of Macro Cells: 48

With 48 macro cells, this product offers ample flexibility and programmability for designing complex logic circuits.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing the overall design layout.

No. of Terminals: 68

With 68 terminals, this product provides ample connectivity options for interfacing with other components in a system.

Programmable IC Type: OT PLD

The OT PLD programmable IC type offers flexibility and customization in logic design, making this product versatile for various applications.

Output Function: MACROCELL

The macrocell output function allows for efficient signal processing and data manipulation, enhancing the product's performance.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency, this product can handle rapid data processing and operations, suitable for high-speed applications.

Technical Specifications

Programmable Logic Devices (PLD) EP1810LC-35 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

12 Dedicated Inputs, 48 I/O

Output Function:

Macrocell

No. of Macro Cells:

48

No. of Dedicated Inputs:

12

No. of I/O Lines:

48

Maximum Clock Frequency:

40 MHz

Propagation Delay:

40 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

48 Macrocell; Configurable I/O

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC68,1.0SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

68

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J68

JTAG Boundary Scan Test:

No

Qualified:

No

Trade Compliance

EP1810LC-35 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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