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EP1830-25IFN

Texas Instruments

EP1830-25IFN by Texas Instruments

EP1830-25IFN by Texas Instruments is a CMOS PLD with 48 macro cells, 28 ns propagation delay, and 5.5 V max supply voltage. Ideal for industrial applications requiring programmable logic devices in a square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,805 parts In-Stock

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8,805

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Digiode

USA . 535 parts In-Stock

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535

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Distributors (Availability)

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AZTECH Wire

Italy . 659 parts In-Stock

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$17.245

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659

$17.245

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Parana Technologies

USA . 1,586 parts In-Stock

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$23.021

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$23.665

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$23.021

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DigiPath Technology Company

USA . 1,546 parts In-Stock

1+ parts

$25.349

100+ parts

$23.321

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1,546

$25.349

$23.321

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ChromeModa Solutions

Germany . 3,740 parts In-Stock

1+ parts

$25.866

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$21.210

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3,740

$25.866

$21.210

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IDEA Electronic Components Group

UK . 299 parts In-Stock

1+ parts

$25.866

100+ parts

$24.573

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$23.279

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299

$25.866

$24.573

$23.279

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One Stop Electronics

USA . 1,096 parts In-Stock

1+ parts

$34.000

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1,096

$34.000

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Corphita

USA . 2,662 parts In-Stock

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2,662

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Northwest PG Solutions

USA . 1,200 parts In-Stock

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Native Components

USA . 857 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the EP1830-25IFN by Texas Instruments! As a leading manufacturer in the industry, Texas Instruments has crafted this Programmable Logic Device to deliver unmatched performance and reliability. Ideal for a variety of applications, this PLD offers customers a seamless integration into their projects, providing efficient solutions with its 48 macro cells and CMOS technology. Experience the value and benefits of the EP1830-25IFN today and elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring good protection for the internal components.

Propagation Delay: 28 ns

The low propagation delay of 28 ns allows for quick signal processing, making this PLD suitable for high-speed applications.

Surface Mount: YES

Being surface mountable facilitates easier and more cost-effective assembly on PCBs, saving space and reducing production time.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this PLD can handle a wide range of voltages, increasing its versatility in different electronic systems.

No. of Macro Cells: 48

Having 48 macro cells provides ample logic capacity for implementing complex functions and designs in the programmable IC.

Technology Used: CMOS

The CMOS technology used in this PLD offers low power consumption, high noise immunity, and compatibility with various digital systems.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy placement on the PCB, optimizing the overall layout.

Nominal Supply Voltage (V): 5

Having a nominal supply voltage of 5 V ensures compatibility with standard power sources, making integration into existing systems straightforward.

Power Supplies (V): 5

Having a single power supply voltage of 5 V simplifies the design and operation of the PLD, reducing the need for additional voltage regulation circuits.

No. of Terminals: 68

With 68 terminals available, there is sufficient connectivity for interfacing with external components and peripherals, enhancing the versatility of the PLD.

Programmable IC Type: OT PLD

Being an OT PLD type, this device offers flexibility in programming and customization, enabling users to configure the logic functions as needed.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides good protection for the internal components and offers easy handling during installation and removal on the PCB.

Output Function: MACROCELL

The macrocell output function allows for efficient combination and implementation of logic functions, enhancing the overall performance of the PLD.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation even under lower voltage conditions, increasing the robustness of the PLD.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enables the PLD to operate reliably in a wide range of environmental conditions, including industrial settings.

Pitch Of Terminal: 1.27 mm

The 1.27 mm pitch of the terminals allows for easy connection and interface with external components, simplifying the overall PCB design.

Organization: 12 DEDICATED INPUTS, 48 I/O

The organization of 12 dedicated inputs and 48 I/O lines provides a well-structured architecture for input/output operations, enhancing the efficiency of signal processing.

No. of Dedicated Inputs: 12

Having 12 dedicated inputs allows for separate handling of specific input signals, improving the overall performance and flexibility of the PLD.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in harsh environmental conditions, making this PLD suitable for a wide range of applications.

Position Of Terminal: QUAD

The quad terminal position offers efficient connectivity options and ease of access for connecting the PLD to the rest of the circuit, simplifying installation and maintenance.

Maximum Seated Height: 4.57 mm

With a maximum seated height of 4.57 mm, this PLD occupies minimal vertical space on the PCB, allowing for compact and efficient PCB layout designs.

Width: 24.2316 mm

The width of 24.2316 mm provides a compact form factor for the PLD, enabling space-efficient integration into electronic systems and PCB designs.

Length: 24.2316 mm

The length of 24.2316 mm offers a balanced aspect ratio for the PLD, making it well-suited for various board layouts and configurations.

No. of I/O Lines: 48

Having 48 I/O lines provides ample connectivity options for interfacing with external devices and components, enhancing the versatility and functionality of the PLD.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature grading ensures reliable performance in challenging environmental conditions, making this PLD suitable for industrial applications.

Technical Specifications

Programmable Logic Devices (PLD) EP1830-25IFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

12 Dedicated Inputs, 48 I/O

Output Function:

Macrocell

No. of Macro Cells:

48

No. of Dedicated Inputs:

12

No. of I/O Lines:

48

Propagation Delay:

28 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

F_Max for 12-bit counter application is 40 MHz; Labs interconnected by PIA; 4 Labs; 48 Macrocells

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC68,1.0SQ

Width:

24.2316 mm

Length:

24.2316 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

68

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J68

JTAG Boundary Scan Test:

No

Qualified:

No

Trade Compliance

EP1830-25IFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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