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EMB1428QSX/NOPB

Texas Instruments

EMB1428QSX/NOPB by Texas Instruments

EMB1428QSX/NOPB by Texas Instruments is a MOSFET gate driver with 48 terminals, suitable for automotive applications. It operates b/w -40 to 125 °C with supply voltage range of 4.5-5.5 V. This half bridge based driver has a compact square package style and AEC-Q100 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,657 parts In-Stock

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Digiode

USA . 2,540 parts In-Stock

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Parana Technologies

USA . 1,124 parts In-Stock

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$2.726

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$3.208

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$2.726

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$3.208

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DigiPath Technology Company

USA . 1,464 parts In-Stock

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$3.002

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$2.762

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ChromeModa Solutions

Germany . 4,799 parts In-Stock

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$3.063

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$2.512

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$3.063

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IDEA Electronic Components Group

UK . 2,312 parts In-Stock

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$3.063

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$2.757

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AZTECH Wire

Italy . 533 parts In-Stock

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$10.909

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One Stop Electronics

USA . 994 parts In-Stock

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$13.500

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Northwest PG Solutions

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Corphita

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Native Components

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Overview

Experience unparalleled performance and reliability with the EMB1428QSX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and innovation in every product they offer. The EMB1428QSX/NOPB belongs to the MOSFET Gate Drivers category, making it essential for a wide range of applications. With a maximum supply voltage of 5.5V and operating temperature up to 125°C, this chip carrier package ensures superior performance in automotive settings. Trust Texas Instruments to deliver cutting-edge technology that provides unmatched value and benefits to customers looking for high-quality solutions for their projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Can operate efficiently within a wide range of supply voltages, providing flexibility in design and compatibility with various systems.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and durability, making it suitable for automotive applications where quality and performance are crucial.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and uniform heat dissipation, contributing to overall system performance.

No. of Terminals: 48

Higher number of terminals provide more connectivity options and flexibility for interfacing with other components, enhancing design possibilities.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style offers heat dissipation capabilities, compact design, and suitability for applications with space constraints.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages, ensuring energy efficiency and compatibility with power sources that may have lower output voltages.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in harsh environments, such as automotive applications with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality even in extreme cold conditions, making it suitable for a variety of environments.

Terminal Position: QUAD

Quad terminal position enables secure and stable connections, reducing the risk of signal disruptions or malfunctions in operation.

Maximum Seated Height: 0.8 mm

Low seated height facilitates compact designs and efficient PCB layout, contributing to overall system miniaturization and space-saving.

Width: 7 mm

Optimal width dimension allows for easy integration into existing PCB layouts and facilitates efficient routing of traces for signal integrity.

Length: 7 mm

Compact length dimension contributes to space-saving designs and flexibility in placement within electronic systems.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature resistance and reliability, making it suitable for automotive applications with demanding operational requirements.

Terminal Form: NO LEAD

No-lead terminal form improves solder joint reliability and thermal performance, ensuring long-term stability and durability in operation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, simplifying integration into various systems.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density mounting and precise connectivity, enabling compact designs and optimized PCB layouts.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Half-bridge based MOSFET driver interface offers efficient switching performance, improved power handling capabilities, and enhanced control over MOSFET operation.

Technical Specifications

MOSFET Gate Drivers EMB1428QSX/NOPB attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED 12V SUPPLY NOMINAL

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

EMB1428QSX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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