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EMB1428QSQX

Texas Instruments

EMB1428QSQX by Texas Instruments

EMB1428QSQX by Texas Instruments is a MOSFET gate driver with a supply voltage range of 4.5V to 5.5V, operating temperature from -40°C to 125°C, and AEC-Q100 screening for automotive applications. This square-shaped chip carrier has 48 terminals, 0.5mm terminal pitch, and is ideal for half-bridge based MOSFET driver interfaces in automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,685 parts In-Stock

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Digiode

USA . 2,396 parts In-Stock

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2,396

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Distributors (Availability)

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One Stop Electronics

USA . 520 parts In-Stock

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$1.500

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520

$1.500

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Native Components

USA . 575 parts In-Stock

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$1.818

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$1.818

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Northwest PG Solutions

USA . 1,111 parts In-Stock

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$2.000

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$2.000

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Parana Technologies

USA . 1,283 parts In-Stock

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$2.508

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$232.908

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$2.257

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1,283

$2.508

$232.908

$2.257

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DigiPath Technology Company

USA . 1,499 parts In-Stock

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$2.762

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$2.541

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$2.762

$2.541

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ChromeModa Solutions

Germany . 4,127 parts In-Stock

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$2.818

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$2.311

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$2.818

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IDEA Electronic Components Group

UK . 77 parts In-Stock

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$2.818

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$2.536

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77

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AZTECH Wire

Italy . 400 parts In-Stock

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$5.462

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$5.462

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,910 parts In-Stock

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Overview

Unlock the power of superior performance with the EMB1428QSQX by Texas Instruments. As a leader in MOSFET Gate Drivers, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for automotive applications, this high-quality product boasts a wide temperature range and advanced features to ensure reliability and efficiency. Elevate your projects with the value and benefits of the EMB1428QSQX – the ultimate choice for discerning customers seeking top-of-the-line performance.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 5.5 V

Can handle high voltage applications, providing flexibility in design.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, ensuring quality in automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, optimizing design layout.

No. of Terminals: 48

Provides versatility in connectivity options, allowing for various configurations and connections.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer flexibility in heat dissipation and space constraints, making it suitable for different application requirements.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme cold conditions, suitable for automotive and industrial applications.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection, reducing the risk of disconnection or short circuits.

Maximum Seated Height: 0.8 mm

Low seated height allows for compact and slim design, ideal for space-constrained applications.

Width: 7 mm

Compact width size enables easy integration into circuit designs with limited space.

Length: 7 mm

Compact length size allows for flexibility in placement within the PCB layout.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance in automotive applications subjected to temperature variations.

Terminal Form: NO LEAD

No-lead terminal form provides reliable and secure connections, reducing the risk of solder joint failures.

Nominal Supply Voltage: 5 V

Nominal supply voltage matches common voltage standards, making it compatible with various systems and devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise and compact connections, suitable for high-density PCB designs.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Half-bridge based MOSFET driver provides efficient switching control and protection for power MOSFETs, enhancing overall system performance.

Technical Specifications

MOSFET Gate Drivers EMB1428QSQX attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

EMB1428QSQX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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