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DSD1700E

Texas Instruments

DSD1700E by Texas Instruments

The Texas Instruments DSD1700E is an 8-bit D/A converter with a supply voltage of 5V, operating b/w 0-70°C. It features a small outline package with gull wing terminals and consumes up to 8mA. Ideal for applications requiring precise analog signal conversion in commercial temperature environments.

Median Price

$9.070

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 37 parts In-Stock

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$9.070

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$9.070

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Verical

USA . 37 parts In-Stock

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$10.300

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$10.300

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Rochester

USA . 21 parts In-Stock

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$7.850

1k+ parts

$7.020

10k+ parts

$6.610

21

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$7.850

$7.020

$6.610

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,306 parts In-Stock

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$8.284

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Vyrian

USA . 8,941 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 41 parts In-Stock

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DigiKey Marketplace

USA . 37 parts In-Stock

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37

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Distributors (Availability)

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One Stop Electronics

USA . 15 parts In-Stock

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$7.410

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15

$7.410

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Corphita

USA . 1,149 parts In-Stock

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$7.848

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$7.848

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Parana Technologies

USA . 2,294 parts In-Stock

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$15.118

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$15.523

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2,294

$15.118

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$15.523

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DigiPath Technology Company

USA . 1,676 parts In-Stock

1+ parts

$16.647

100+ parts

$15.315

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1,676

$16.647

$15.315

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IDEA Electronic Components Group

UK . 2,310 parts In-Stock

1+ parts

$16.987

100+ parts

$16.138

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$15.288

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2,310

$16.987

$16.138

$15.288

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ChromeModa Solutions

Germany . 727 parts In-Stock

1+ parts

$16.987

100+ parts

$13.929

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727

$16.987

$13.929

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Northwest PG Solutions

USA . 1,961 parts In-Stock

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Native Components

USA . 509 parts In-Stock

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Microchip USA

USA . 260 parts In-Stock

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Overview

Unlock the power of digital-to-analog conversion with the Texas Instruments DSD1700E. Manufactured by a trusted industry leader, this high-quality converter offers seamless integration into a variety of applications. With its compact design and reliable performance, the DSD1700E provides customers with unparalleled value and flexibility. Experience the benefits of precision engineering and cutting-edge technology with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy assembly onto printed circuit boards, saving space and simplifying the manufacturing process.

No. of Bits: 8

Provides a good resolution for converting digital signals to analog, suitable for many applications without unnecessary complexity.

Power Supplies (V): 5

Operates at a common voltage level of 5V, making it compatible with a wide range of systems and power sources.

No. of Terminals: 28

Sufficient number of terminals for connectivity and configuration options, allowing for versatile usage in different setups.

Maximum Operating Temperature: 70 °C

Capable of functioning reliably within a wide temperature range, suitable for various environments and applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with digital circuits, enhancing the overall performance of the product.

Technical Specifications

Digital-to-Analog Converters DSD1700E attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Supply Current:

8 mA

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP28,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

Trade Compliance

DSD1700E Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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