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DSD1792ADBG4

Texas Instruments

DSD1792ADBG4 by Texas Instruments

DSD1792ADBG4 by Texas Instruments is a 24-bit Digital-to-Analog Converter with power supplies of 3.3V and 5V. It features a small outline package style, operates b/w -25°C to 85°C, and has a max supply current of 40mA. Ideal for applications requiring high-resolution audio output in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,638 parts In-Stock

1+ parts

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3,638

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Digiode

USA . 614 parts In-Stock

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614

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$7.026

100+ parts

-

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642

$7.026

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One Stop Electronics

USA . 1,200 parts In-Stock

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$10.000

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-

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1,200

$10.000

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Parana Technologies

USA . 2,249 parts In-Stock

1+ parts

$16.126

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$16.455

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2,249

$16.126

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$16.455

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DigiPath Technology Company

USA . 1,875 parts In-Stock

1+ parts

$17.757

100+ parts

$16.336

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1,875

$17.757

$16.336

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ChromeModa Solutions

Germany . 5,750 parts In-Stock

1+ parts

$18.119

100+ parts

$14.858

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5,750

$18.119

$14.858

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IDEA Electronic Components Group

UK . 319 parts In-Stock

1+ parts

$18.119

100+ parts

$17.213

1k+ parts

$16.307

10k+ parts

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319

$18.119

$17.213

$16.307

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Microchip USA

USA . 3,414 parts In-Stock

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3,414

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Corphita

USA . 1,424 parts In-Stock

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1,424

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Northwest PG Solutions

USA . 1,356 parts In-Stock

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1,356

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Native Components

USA . 579 parts In-Stock

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579

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Overview

Unlock the power of digital audio with the DSD1792ADBG4 by Texas Instruments. As a leading manufacturer in digital-to-analog converters, Texas Instruments delivers exceptional quality and reliability. This versatile converter is perfect for applications in audio equipment, musical instruments, and more. With its small outline package and high-performance technology, the DSD1792ADBG4 offers customers exceptional value, superior sound quality, and seamless integration. Upgrade your audio experience with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable for long-term use.

Surface Mount: YES

Being surface mount allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

No. of Bits: 24

With 24 bits, this converter can provide high precision and accuracy in converting digital signals to analog signals.

Power Supplies (V): 3.3,5

Supports multiple power supply voltages, providing flexibility in different applications and compatibility with various systems.

No. of Terminals: 28

The high number of terminals allows for versatile connectivity options and ensures reliable signal transmission.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices, making it an efficient choice for digital-to-analog conversion.

Nominal Supply Voltage: 5 V

Supports a common nominal supply voltage of 5V, making it compatible with many standard electronic systems and components.

Technical Specifications

Digital-to-Analog Converters DSD1792ADBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, 2's Complement Binary

Maximum Supply Current:

40 mA

No. of Bits:

24

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP28,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DSD1792ADBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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