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DSD1608PAHRG4

Texas Instruments

DSD1608PAHRG4 by Texas Instruments

DSD1608PAHRG4 by Texas Instruments is a 24-bit D/A converter with max output voltage of 4.4V, EL of 0.0008%, and operates at -25 to 85°C. Ideal for applications requiring precise analog signal conversion in compact spaces due to its thin profile flatpack package style and serial input format.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,367 parts In-Stock

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Digiode

USA . 4,298 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,200 parts In-Stock

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AZTECH Wire

Italy . 228 parts In-Stock

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$6.651

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Parana Technologies

USA . 1,782 parts In-Stock

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$10.304

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$10.829

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DigiPath Technology Company

USA . 1,044 parts In-Stock

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$11.345

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$10.438

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ChromeModa Solutions

Germany . 3,545 parts In-Stock

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$11.577

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$9.493

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$11.577

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IDEA Electronic Components Group

UK . 1,311 parts In-Stock

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$11.577

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$10.998

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$10.419

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One Stop Electronics

USA . 329 parts In-Stock

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$24.000

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Kepictronics

USA . 6,899 parts In-Stock

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Corphita

USA . 3,933 parts In-Stock

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Native Components

USA . 119 parts In-Stock

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Northwest PG Solutions

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Overview

Unlock the power of precision with the DSD1608PAHRG4 by Texas Instruments, a leader in digital-to-analog converters. This cutting-edge technology offers unparalleled accuracy and reliability for your applications. Whether you're designing audio equipment, industrial controls, or automotive systems, this product delivers outstanding performance and value. Trust Texas Instruments to provide the quality and innovation you need to take your projects to the next level.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.4 V

Provides a high maximum analog output voltage for accurate and precise signal conversion.

No. of Bits: 24

Offers a high resolution with 24 bits, ensuring detailed and accurate conversion of digital signals to analog.

Maximum Linearity Error (EL): 0.0008 %

Ensures minimal linearity error, resulting in accurate and consistent analog output.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Input Format: SERIAL

Supports serial input format, making it compatible with a wide range of digital devices and systems.

Technical Specifications

Digital-to-Analog Converters DSD1608PAHRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

Maximum Linearity Error (EL):

0.0008 %

No. of Bits:

24

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

4.4 V

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

52

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile

Package Code:

Package Equivalence Code:

TQFP52,.47SQ,25

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Trade Compliance

DSD1608PAHRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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