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DSD1608PAHG4

Texas Instruments

DSD1608PAHG4 by Texas Instruments

The Texas Instruments DSD1608PAHG4 is a 24-bit DAC with 4.4V max analog output voltage, ideal for audio applications. It operates at -25 to 85°C, has a linearity error of 0.0008%, and uses CMOS technology. With a compact square package and GULL WING terminals, it's suitable for space-constrained designs requiring high precision.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,718 parts In-Stock

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6,718

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Digiode

USA . 3,607 parts In-Stock

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3,607

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 672 parts In-Stock

1+ parts

$12.651

100+ parts

-

1k+ parts

$13.115

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672

$12.651

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$13.115

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One Stop Electronics

USA . 366 parts In-Stock

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$13.000

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366

$13.000

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IDEA Electronic Components Group

UK . 1,985 parts In-Stock

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$14.215

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$13.504

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$12.794

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1,985

$14.215

$13.504

$12.794

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ChromeModa Solutions

Germany . 1,559 parts In-Stock

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$14.215

100+ parts

$11.656

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1,559

$14.215

$11.656

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AZTECH Wire

Italy . 464 parts In-Stock

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$17.414

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464

$17.414

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Native Components

USA . 548 parts In-Stock

1+ parts

$462.150

100+ parts

$452.907

1k+ parts

$448.285

10k+ parts

$443.664

548

$462.150

$452.907

$448.285

$443.664

Northwest PG Solutions

USA . 1,810 parts In-Stock

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$508.365

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1,810

$508.365

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Corphita

USA . 847 parts In-Stock

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DigiPath Technology Company

USA . 485 parts In-Stock

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$12.816

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485

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$12.816

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Overview

Experience unparalleled precision and performance with the Texas Instruments DSD1608PAHG4 Digital-to-Analog Converter. As a leader in the industry, Texas Instruments guarantees top-quality products that deliver exceptional results. This converter boasts a maximum linearity error of just 0.0008%, ensuring accurate output voltage. Perfect for a wide range of applications, this converter offers customers unmatched value, reliability, and efficiency. Upgrade your system with the DSD1608PAHG4 and unlock a whole new level of precision and control.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.4 V

Provides high output voltage, allowing for a wider range of analog signals to be accurately converted.

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material choice for the package body.

Surface Mount: YES

Allows for easy integration onto PCBs, making it suitable for compact designs.

No. of Bits: 24

High resolution with 24 bits, ensuring accurate conversion of digital signals to analog.

Maximum Linearity Error (EL): 0.0008 %

Provides high accuracy in analog output, minimizing error in conversion.

Power Supplies (V): 3.3,5

Supports multiple power supply options for flexibility in system integration.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable electrical connections and improves longevity of the product.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Digital-to-Analog Converters DSD1608PAHG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

Maximum Linearity Error (EL):

0.0008 %

No. of Bits:

24

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

4.4 V

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

52

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile

Package Code:

Package Equivalence Code:

TQFP52,.47SQ,25

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Trade Compliance

DSD1608PAHG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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