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DSD1702E/2KG4

Texas Instruments

DSD1702E/2KG4 by Texas Instruments

DSD1702E/2KG4 by Texas Instruments is a 24-bit Digital-to-Analog Converter with max output voltage of 3.41V, operating temp range -25 to 85°C, and input format serial. It's ideal for applications requiring precise analog signal generation in compact spaces due to its small outline package style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,852 parts In-Stock

1+ parts

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6,852

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Digiode

USA . 4,411 parts In-Stock

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4,411

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 683 parts In-Stock

1+ parts

$9.447

100+ parts

-

1k+ parts

$10.060

10k+ parts

-

683

$9.447

-

$10.060

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ChromeModa Solutions

Germany . 4,991 parts In-Stock

1+ parts

$10.615

100+ parts

$8.704

1k+ parts

-

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4,991

$10.615

$8.704

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IDEA Electronic Components Group

UK . 1,748 parts In-Stock

1+ parts

$10.615

100+ parts

$10.084

1k+ parts

$9.554

10k+ parts

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1,748

$10.615

$10.084

$9.554

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AZTECH Wire

Italy . 879 parts In-Stock

1+ parts

$18.809

100+ parts

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879

$18.809

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One Stop Electronics

USA . 668 parts In-Stock

1+ parts

$21.000

100+ parts

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668

$21.000

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DigiPath Technology Company

USA . 1,634 parts In-Stock

1+ parts

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100+ parts

$9.570

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1,634

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$9.570

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Corphita

USA . 581 parts In-Stock

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581

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Northwest PG Solutions

USA . 296 parts In-Stock

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296

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Native Components

USA . 119 parts In-Stock

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119

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Overview

Elevate your audio experience with the DSD1702E/2KG4 by Texas Instruments. As a leader in digital-to-analog converters, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this converter offers a maximum analog output voltage of 3.41V, ensuring optimal performance every time. With a compact design and dual terminal position, this product is versatile and easy to integrate into your projects. Trust Texas Instruments to provide you with the value, benefits, and advantages you need to take your audio projects to the next level.

Feature Benefit Bullets

Maximum Analog Output Voltage: 3.41 V

Provides a high maximum analog output voltage, allowing for a wide range of signal outputs.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Surface Mount: YES

Enables easy and convenient mounting on circuit boards.

No. of Bits: 24

Offers high resolution for accurate and precise analog output.

Power Supplies (V): 3.3,5

Supports multiple power supply options, providing flexibility in system design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style saves space on the PCB and ensures efficient layout.

Maximum Operating Temperature: 85 °C

Allows for operation in a wide range of temperature environments.

Minimum Operating Temperature: -25 °C

Ensures reliable performance in low-temperature conditions.

Input Format: SERIAL

Provides a convenient input format for interfacing with other digital systems.

Converter Type: D/A CONVERTER

Specifically designed for converting digital signals to analog signals with high precision.

Technical Specifications

Digital-to-Analog Converters DSD1702E/2KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

No. of Bits:

24

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

3.41 V

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.025 in (0.635 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.341 in (8.65 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP20,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Trade Compliance

DSD1702E/2KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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