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DSD1791DBG4

Texas Instruments

DSD1791DBG4 by Texas Instruments

DSD1791DBG4 by Texas Instruments is a 24-bit D/A converter with max analog output voltage of 3.2V, suitable for applications requiring precise digital-to-analog conversion. It operates at temperatures ranging from -25 to 85°C and supports input formats like serial, making it ideal for various electronic devices. With a small outline package style and dual terminal position, this CMOS technology-based converter offers high performance in a compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,297 parts In-Stock

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Vyrian

USA . 2,086 parts In-Stock

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2,086

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Distributors (Availability)

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AZTECH Wire

Italy . 205 parts In-Stock

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$5.931

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205

$5.931

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Parana Technologies

USA . 2,321 parts In-Stock

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$19.482

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$19.488

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2,321

$19.482

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$19.488

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DigiPath Technology Company

USA . 814 parts In-Stock

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$21.452

100+ parts

$19.736

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814

$21.452

$19.736

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ChromeModa Solutions

Germany . 4,849 parts In-Stock

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$21.890

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$17.950

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4,849

$21.890

$17.950

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IDEA Electronic Components Group

UK . 1,467 parts In-Stock

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$21.890

100+ parts

$20.796

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$19.701

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1,467

$21.890

$20.796

$19.701

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One Stop Electronics

USA . 1,318 parts In-Stock

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$32.000

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$32.000

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Corphita

USA . 4,768 parts In-Stock

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Northwest PG Solutions

USA . 2,078 parts In-Stock

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Native Components

USA . 743 parts In-Stock

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Overview

Unlock a world of unparalleled audio quality with the DSD1791DBG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge Digital-to-Analog Converters that redefine audio experiences. This versatile product offers a maximum analog output voltage of 3.2V, making it ideal for a wide range of applications. With its compact design and top-notch performance, the DSD1791DBG4 is the perfect choice for customers looking for exceptional value and superior sound quality. Elevate your audio projects with Texas Instruments today!

Feature Benefit Bullets

Maximum Analog Output Voltage: 3.2 V

High maximum analog output voltage allows for greater flexibility in signal processing and control.

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides a cost-effective and durable housing for the digital-to-analog converter.

Surface Mount: YES

Surface mount capability makes it easy to integrate this D/A converter onto PCBs for efficient and compact designs.

No. of Bits: 24

24-bit resolution allows for high precision in converting digital signals to analog output.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages provides flexibility in different system configurations.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for stable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for improved signal accuracy.

Input Format: SERIAL

Serial input format simplifies interfacing with microcontrollers and digital signal processors.

Technical Specifications

Digital-to-Analog Converters DSD1791DBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, Offset Binary, 2's Complement Binary

Maximum Supply Current:

16 mA

No. of Bits:

24

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

3.2 V

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP28,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DSD1791DBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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