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DLP470TPFQN

Texas Instruments

DLP470TPFQN by Texas Instruments

DLP470TPFQN by Texas Instruments is a ceramic, metal-sealed grid array IC with 250 terminals. Operating b/w -20°C to 90°C, it requires a supply voltage of 1.65V to 1.95V. Ideal for consumer circuits, this rectangular package measures 25.65mm in length and has a terminal pitch of 1mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,836 parts In-Stock

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Digiode

USA . 3,540 parts In-Stock

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3,540

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Distributors (Availability)

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Parana Technologies

USA . 1,937 parts In-Stock

1+ parts

$0.116

100+ parts

-

1k+ parts

$1.467

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1,937

$0.116

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$1.467

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ChromeModa Solutions

Germany . 5,876 parts In-Stock

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$0.130

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$0.107

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$0.130

$0.107

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

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$0.130

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$0.117

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1,549

$0.130

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$0.117

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AZTECH Wire

Italy . 653 parts In-Stock

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$16.502

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653

$16.502

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One Stop Electronics

USA . 1,187 parts In-Stock

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$19.800

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1,187

$19.800

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Northwest PG Solutions

USA . 2,239 parts In-Stock

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2,239

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Corphita

USA . 1,339 parts In-Stock

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Native Components

USA . 575 parts In-Stock

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575

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DigiPath Technology Company

USA . 384 parts In-Stock

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$0.117

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384

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$0.117

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Microchip USA

USA . 217 parts In-Stock

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Overview

Experience the cutting-edge innovation of Texas Instruments with the DLP470TPFQN, a premier consumer IC that delivers unparalleled quality and performance. This advanced product is designed with a package body material composed of ceramic and metal-sealed cofired materials, ensuring maximum durability and reliability. With applications spanning various industries, this rectangular-shaped IC offers exceptional value to customers seeking high-quality electronic solutions. Trust in Texas Instruments for top-of-the-line products that provide unmatched benefits and advantages for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability for the consumer IC, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable makes it easier to integrate into circuit boards, saving space and simplifying assembly processes.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this consumer IC can withstand a wide range of environmental conditions, improving its versatility.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage requirement allows for efficient power usage, making this product suitable for energy-efficient applications.

Width: 16.9 mm

Compact width makes it suitable for applications where space is limited, enabling versatile integration into various devices.

Technical Specifications

Other Function Consumer ICs DLP470TPFQN attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-N250

Length:

25.65 mm

No. of Functions:

1

No. of Terminals:

250

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

4.348 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

16.9 mm

Trade Compliance

DLP470TPFQN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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