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DLP470NEAAFXH

Texas Instruments

DLP470NEAAFXH by Texas Instruments

Texas Instruments' DLP470NEAAFXH is a ceramic, metal-sealed co-fired IC with 257 terminals. Operating b/w 0-90°C, it requires 1.65-1.95V supply voltage and supports surface mount applications in consumer circuits.

Median Price

$210.578

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35 parts In-Stock

1+ parts

$202.176

100+ parts

$183.005

1k+ parts

$174.290

10k+ parts

-

35

$202.176

$183.005

$174.290

-

Mouser Electronics

USA . 62 parts In-Stock

1+ parts

$218.980

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$218.980

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 820 parts In-Stock

1+ parts

$192.067

100+ parts

-

1k+ parts

-

10k+ parts

-

820

$192.067

-

-

-

Vyrian

USA . 3,048 parts In-Stock

1+ parts

$202.176

100+ parts

-

1k+ parts

-

10k+ parts

-

3,048

$202.176

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 858 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

$0.192

858

$0.200

-

-

$0.192

Northwest PG Solutions

USA . 350 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

$0.194

350

$0.220

-

-

$0.194

Parana Technologies

USA . 542 parts In-Stock

1+ parts

$2.372

100+ parts

-

1k+ parts

$2.870

10k+ parts

-

542

$2.372

-

$2.870

-

ChromeModa Solutions

Germany . 2,394 parts In-Stock

1+ parts

$2.665

100+ parts

$2.185

1k+ parts

-

10k+ parts

-

2,394

$2.665

$2.185

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-

IDEA Electronic Components Group

UK . 1,388 parts In-Stock

1+ parts

$2.665

100+ parts

-

1k+ parts

$2.398

10k+ parts

-

1,388

$2.665

-

$2.398

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Corphita

USA . 162 parts In-Stock

1+ parts

$181.958

100+ parts

-

1k+ parts

-

10k+ parts

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162

$181.958

-

-

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Microchip USA

USA . 1,968 parts In-Stock

1+ parts

$238.810

100+ parts

$232.440

1k+ parts

$229.250

10k+ parts

$226.070

1,968

$238.810

$232.440

$229.250

$226.070

QUARKTWIN TECHNOLOGY LTD

USA . 10,596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,596

-

-

-

-

DigiPath Technology Company

USA . 2,062 parts In-Stock

1+ parts

-

100+ parts

$2.403

1k+ parts

-

10k+ parts

-

2,062

-

$2.403

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Overview

Experience unmatched performance and reliability with the DLP470NEAAFXH by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in every product they create. The DLP470NEAAFXH falls under the category of Other Function Consumer ICs, offering a wide range of applications for various consumer electronics. From its ceramic, metal-sealed co-fired package body material to its grid array package style, this IC delivers exceptional value and benefits to customers. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mount technology compatible allows for easy and efficient assembly onto circuit boards, saving time and effort.

Package Shape: RECTANGULAR

The rectangular package shape makes it easier to integrate this IC into existing circuit designs and systems.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this product can withstand demanding conditions without performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures this IC can function effectively in a wide range of environments.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement makes this IC suitable for energy-efficient applications and extends battery life.

Maximum Supply Voltage (Vsup): 1.95 V

The relatively low maximum supply voltage ensures safe operation and protects the IC from potential damage due to overvoltage.

Technical Specifications

Other Function Consumer ICs DLP470NEAAFXH attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-B257

No. of Functions:

1

No. of Terminals:

257

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

DLP470NEAAFXH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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