Loading...

DLP471TEA0FYN

Texas Instruments

DLP471TEA0FYN by Texas Instruments

DLP471TEA0FYN by Texas Instruments is a rectangular consumer IC with 149 terminals. It operates b/w 0-70°C, featuring nickel palladium gold terminal finish and a grid array package style. Ideal for commercial applications requiring precise consumer circuit functionality in compact designs.

Median Price

$291.770

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$291.770

100+ parts

$274.010

1k+ parts

-

10k+ parts

-

1

$291.770

$274.010

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,547 parts In-Stock

1+ parts

$277.182

100+ parts

-

1k+ parts

-

10k+ parts

-

4,547

$277.182

-

-

-

Vyrian

USA . 2,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,104

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 980 parts In-Stock

1+ parts

$3.052

100+ parts

-

1k+ parts

$3.565

10k+ parts

-

980

$3.052

-

$3.565

-

DigiPath Technology Company

USA . 39 parts In-Stock

1+ parts

$3.360

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$3.360

-

-

-

IDEA Electronic Components Group

UK . 1,882 parts In-Stock

1+ parts

$3.429

100+ parts

-

1k+ parts

$3.086

10k+ parts

-

1,882

$3.429

-

$3.086

-

ChromeModa Solutions

Germany . 116 parts In-Stock

1+ parts

$3.429

100+ parts

$2.812

1k+ parts

-

10k+ parts

-

116

$3.429

$2.812

-

-

Native Components

USA . 995 parts In-Stock

1+ parts

$10.170

100+ parts

-

1k+ parts

-

10k+ parts

-

995

$10.170

-

-

-

Northwest PG Solutions

USA . 1,836 parts In-Stock

1+ parts

$11.187

100+ parts

$10.068

1k+ parts

-

10k+ parts

-

1,836

$11.187

$10.068

-

-

Corphita

USA . 632 parts In-Stock

1+ parts

$262.593

100+ parts

-

1k+ parts

-

10k+ parts

-

632

$262.593

-

-

-

Microchip USA

USA . 1,340 parts In-Stock

1+ parts

$271.590

100+ parts

$264.350

1k+ parts

$260.730

10k+ parts

$257.110

1,340

$271.590

$264.350

$260.730

$257.110

Overview

Unleash the power of innovation with the DLP471TEA0FYN by Texas Instruments. Crafted with precision and expertise, this consumer IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this rectangular ceramic package is designed to exceed expectations. Elevate your projects with the superior performance and efficiency of this cutting-edge technology. Embrace the future with Texas Instruments and experience the difference in excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and thermal stability, making it a reliable choice for electronic components.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement in electronic circuits.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, ensuring compatibility and reliability for everyday use.

Maximum Operating Temperature: 70 °C

Can operate efficiently in a wide range of temperatures, providing flexibility in usage scenarios.

Terminal Finish: NICKEL PALLADIUM GOLD

Gold finish ensures good conductivity and resistance to corrosion, maintaining stable performance over time.

Width: 22.3 mm

Compact width allows for efficient use of space in electronic circuits.

Length: 32.2 mm

Optimal length for accommodating multiple terminals and components within the package.

Technical Specifications

Other Function Consumer ICs DLP471TEA0FYN attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CPGA-P149

JESD-609 Code:

e4

Length:

32.2 mm

No. of Functions:

1

No. of Terminals:

149

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

PGA149,20x16

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Maximum Seated Height:

3.47 mm

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

22.3 mm

Trade Compliance

DLP471TEA0FYN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 13