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DLP470TEAAFXJ

Texas Instruments

DLP470TEAAFXJ by Texas Instruments

DLP470TEAAFXJ by Texas Instruments is a ceramic, metal-sealed grid array IC with 257 terminals. It operates b/w 0-90°C and requires a supply voltage of 1.65-1.95V. Ideal for consumer circuits, this IC is surface mountable and suitable for various applications in electronics.

Median Price

$320.466

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 83 parts In-Stock

1+ parts

$242.612

100+ parts

$219.605

1k+ parts

$209.148

10k+ parts

-

83

$242.612

$219.605

$209.148

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Mouser Electronics

USA . 39 parts In-Stock

1+ parts

$398.320

100+ parts

-

1k+ parts

-

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39

$398.320

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,449 parts In-Stock

1+ parts

$230.481

100+ parts

-

1k+ parts

-

10k+ parts

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1,449

$230.481

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Vyrian

USA . 5,600 parts In-Stock

1+ parts

-

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5,600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,033 parts In-Stock

1+ parts

$2.407

100+ parts

$223.568

1k+ parts

$2.167

10k+ parts

-

2,033

$2.407

$223.568

$2.167

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DigiPath Technology Company

USA . 2,077 parts In-Stock

1+ parts

$2.651

100+ parts

-

1k+ parts

-

10k+ parts

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2,077

$2.651

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-

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ChromeModa Solutions

Germany . 5,985 parts In-Stock

1+ parts

$2.705

100+ parts

$2.218

1k+ parts

-

10k+ parts

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5,985

$2.705

$2.218

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-

IDEA Electronic Components Group

UK . 1,070 parts In-Stock

1+ parts

$2.705

100+ parts

-

1k+ parts

$2.434

10k+ parts

-

1,070

$2.705

-

$2.434

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Corphita

USA . 3,637 parts In-Stock

1+ parts

$218.351

100+ parts

-

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10k+ parts

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3,637

$218.351

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Microchip USA

USA . 2,877 parts In-Stock

1+ parts

$286.570

100+ parts

$278.930

1k+ parts

$275.100

10k+ parts

$271.280

2,877

$286.570

$278.930

$275.100

$271.280

QUARKTWIN TECHNOLOGY LTD

USA . 7,846 parts In-Stock

1+ parts

-

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7,846

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Northwest PG Solutions

USA . 1,035 parts In-Stock

1+ parts

-

100+ parts

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1,035

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-

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Native Components

USA . 614 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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614

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Overview

Elevate your consumer electronics with the DLP470TEAAFXJ from Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers top-notch products that exceed industry standards. The DLP470TEAAFXJ is a versatile choice for a wide range of applications in the consumer electronics category, offering exceptional value and performance. With its advanced features and reliability, this product ensures a seamless user experience and unmatched satisfaction. Trust Texas Instruments to bring innovation and excellence to your projects with the DLP470TEAAFXJ.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent heat dissipation and durability, making the product suitable for high temperature environments.

Surface Mount: YES

Surface mount technology allows for easier assembly processes and enables the product to have a compact design.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easier to integrate the product into various electronic systems.

No. of Terminals: 257

Having a high number of terminals allows for more connections and functionalities, providing versatility in usage.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the product can perform reliably in demanding conditions without overheating.

Minimum Operating Temperature: 0 °C

The product can operate in a wide range of temperatures, making it suitable for both indoor and outdoor applications.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage ensures that the product can operate efficiently with minimal power consumption.

Maximum Supply Voltage (Vsup): 1.95 V

The maximum supply voltage allows for a wide input range, accommodating different power sources.

Technical Specifications

Other Function Consumer ICs DLP470TEAAFXJ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-B257

No. of Functions:

1

No. of Terminals:

257

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

DLP470TEAAFXJ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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