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DLP470NEFXH

Texas Instruments

DLP470NEFXH by Texas Instruments

DLP470NEFXH by Texas Instruments is a consumer IC with 257 terminals in a rectangular grid array package. It operates b/w 0-90°C, with supply voltage ranging from 1.65V to 1.95V. This IC is suitable for various consumer circuit applications due to its compact size and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,133 parts In-Stock

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4,133

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Vyrian

USA . 3,139 parts In-Stock

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3,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 477 parts In-Stock

1+ parts

$2.452

100+ parts

-

1k+ parts

$2.944

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477

$2.452

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$2.944

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DigiPath Technology Company

USA . 566 parts In-Stock

1+ parts

$2.700

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566

$2.700

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ChromeModa Solutions

Germany . 4,130 parts In-Stock

1+ parts

$2.755

100+ parts

$2.259

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4,130

$2.755

$2.259

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IDEA Electronic Components Group

UK . 89 parts In-Stock

1+ parts

$2.755

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$2.480

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89

$2.755

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$2.480

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Northwest PG Solutions

USA . 554 parts In-Stock

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$3.221

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554

$3.221

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AZTECH Wire

Italy . 702 parts In-Stock

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$16.870

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702

$16.870

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One Stop Electronics

USA . 448 parts In-Stock

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$20.800

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448

$20.800

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Corphita

USA . 3,729 parts In-Stock

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3,729

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Native Components

USA . 793 parts In-Stock

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$2.840

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793

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$2.840

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Microchip USA

USA . 417 parts In-Stock

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417

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Overview

Experience unparalleled performance and reliability with the DLP470NEFXH by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge solutions for various applications in the consumer electronics industry. This product offers exceptional value and benefits to customers, making it an ideal choice for your next project. Trust in Texas Instruments to provide you with the best in consumer ICs, ensuring optimal performance and efficiency every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability for the product, making it suitable for various operating conditions.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of circuits, saving time and effort.

Package Shape: RECTANGULAR

The rectangular shape makes for efficient use of space and easy integration into circuit designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring optimal performance for everyday use.

No. of Terminals: 257

Having a large number of terminals allows for a greater number of connections and functionalities in the circuit.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout for the terminals, enhancing overall circuit efficiency.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even under extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal positioning allows for convenient and secure connections in the circuit design.

Maximum Seated Height: 4.788 mm

A relatively low seated height makes this product suitable for compact devices and applications with limited vertical space.

Width: 22.3 mm

The moderate width of the product enables seamless integration into various circuit layouts and configurations.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with a wide range of systems.

Length: 32.2 mm

The length of the product offers flexibility in designing and accommodating the IC in different electronic devices.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and reduces the risk of potential issues related to lead-based components.

Terminal Pitch: 1 mm

With a small terminal pitch, this product allows for dense and intricate circuit designs while maintaining reliable connections.

Maximum Supply Voltage (Vsup): 1.95 V

The high maximum supply voltage capability ensures compatibility with various power sources and operating conditions.

Technical Specifications

Other Function Consumer ICs DLP470NEFXH attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-N257

Length:

32.2 mm

No. of Functions:

1

No. of Terminals:

257

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

4.788 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

22.3 mm

Trade Compliance

DLP470NEFXH General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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