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DLP480REFXG

Texas Instruments

DLP480REFXG by Texas Instruments

DLP480REFXG by Texas Instruments is a ceramic, metal-sealed grid array IC with 257 terminals. Operating b/w 0-90°C, it has a supply voltage range of 1.65-1.95V. Ideal for consumer circuits, this rectangular package is surface-mountable and measures 32.2mm x 22.3mm x 4.788mm in size.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,904 parts In-Stock

1+ parts

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6,904

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Digiode

USA . 535 parts In-Stock

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535

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 183 parts In-Stock

1+ parts

$0.494

100+ parts

-

1k+ parts

$1.622

10k+ parts

-

183

$0.494

-

$1.622

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DigiPath Technology Company

USA . 1,512 parts In-Stock

1+ parts

$0.544

100+ parts

$0.500

1k+ parts

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1,512

$0.544

$0.500

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ChromeModa Solutions

Germany . 3,250 parts In-Stock

1+ parts

$0.555

100+ parts

$0.455

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3,250

$0.555

$0.455

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IDEA Electronic Components Group

UK . 2,034 parts In-Stock

1+ parts

$0.555

100+ parts

-

1k+ parts

$0.500

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2,034

$0.555

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$0.500

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AZTECH Wire

Italy . 450 parts In-Stock

1+ parts

$11.373

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450

$11.373

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One Stop Electronics

USA . 381 parts In-Stock

1+ parts

$16.800

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381

$16.800

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Native Components

USA . 410 parts In-Stock

1+ parts

$79.900

100+ parts

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$76.704

410

$79.900

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$76.704

Northwest PG Solutions

USA . 232 parts In-Stock

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$87.890

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232

$87.890

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Corphita

USA . 2,313 parts In-Stock

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2,313

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Microchip USA

USA . 440 parts In-Stock

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440

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Overview

Experience unparalleled quality and innovation with the DLP480REFXG by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers cutting-edge technology in the category of Other Function Consumer ICs. This product boasts a durable ceramic, metal-sealed co-fired package body material, making it reliable for a wide range of applications. With its compact size and superior performance, the DLP480REFXG offers exceptional value to customers seeking high-quality consumer circuits. Trust in Texas Instruments for advanced solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides excellent durability and reliability for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Package Shape: RECTANGULAR

Rectangular package shape allows for space-efficient integration into electronic devices.

No. of Terminals: 257

High number of terminals provide ample connectivity options for diverse circuit configurations.

Maximum Operating Temperature: 90 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in colder environments.

Terminal Position: BOTTOM

Bottom terminal position enables easy integration and connection within circuit assemblies.

Width: 22.3 mm

Compact width facilitates space-saving installation of the product in electronic devices.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement allows for energy-efficient operation.

Length: 32.2 mm

Moderate length provides a balance between compact design and functional layout for the product.

Terminal Form: NO LEAD

No lead terminal form eliminates potential lead-related issues and enhances product safety.

Terminal Pitch: 1 mm

Small terminal pitch enables precise and compact placement of the product in circuit designs.

Maximum Supply Voltage (Vsup): 1.95 V

Moderate maximum supply voltage requirement ensures safe operation within specified limits.

Technical Specifications

Other Function Consumer ICs DLP480REFXG attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CBGA-N257

Length:

32.2 mm

No. of Functions:

1

No. of Terminals:

257

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

4.788 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

22.3 mm

Trade Compliance

DLP480REFXG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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